Lead arrangement, electric connector and electric assembly
First Claim
1. A lead arrangement adapted for an electric connector, the lead arrangement comprising:
- a first lead lane comprising;
a pair of first differential signal leads;
a pair of second differential signal leads; and
a first ground lead positioned between the two pairs of differential signal leads,wherein each of the pair of first differential signal leads, the pair of second differential signal leads and the first ground lead has a surface mounting segment adapted for being soldered onto a surface pad of a circuit board,wherein the pair of first differential signal leads is a pair of transmitting differential signal leads Tx+ and Tx−
in architecture of universal serial bus 3.0 (USB 3.0), and the pair of second differential signal leads is a pair of receiving differential signal leads Rx+ and Rx−
in architecture of USB 3.0.
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Accused Products
Abstract
A lead arrangement is provided for an electric connector. The lead arrangement includes a first lead lane that includes a pair of first differential signal leads, a pair of second differential signal leads and a first ground lead between the two pairs of differential signal leads. Each of the first differential signal leads, the second differential signal leads and the ground lead has a surface mounting segment adapted for being soldered onto a surface pad of a circuit board. The pair of first differential signal leads is a pair of transmitting differential signal leads Tx+ and Tx− in architecture of universal serial bus 3.0 (USB 3.0), and the pair of second differential signal leads is a pair of receiving differential signal leads Rx+ and Rx− in architecture of USB 3.0.
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Citations
21 Claims
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1. A lead arrangement adapted for an electric connector, the lead arrangement comprising:
a first lead lane comprising; a pair of first differential signal leads; a pair of second differential signal leads; and a first ground lead positioned between the two pairs of differential signal leads, wherein each of the pair of first differential signal leads, the pair of second differential signal leads and the first ground lead has a surface mounting segment adapted for being soldered onto a surface pad of a circuit board, wherein the pair of first differential signal leads is a pair of transmitting differential signal leads Tx+ and Tx−
in architecture of universal serial bus 3.0 (USB 3.0), and the pair of second differential signal leads is a pair of receiving differential signal leads Rx+ and Rx−
in architecture of USB 3.0.- View Dependent Claims (2, 3, 4, 5)
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6. An electric connector comprising:
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a metal housing; an insulating base connected to the metal housing; and a lead arrangement disposed on the insulating base, the lead arrangement comprising; a first lead lane comprising; a pair of first differential signal leads; a pair of second differential signal leads; and a first ground lead positioned between the two pairs of differential signal leads, wherein each of the pair of first differential signal leads, the pair of second differential signal leads and the first ground lead has a surface mounting segment adapted for being soldered onto a surface pad of a circuit board, wherein the pair of first differential signal leads is a pair of transmitting differential signal leads Tx+ and Tx−
in architecture of USB 3.0, and the pair of second differential signal leads is a pair of receiving differential signal leads Rx+ and Rx−
in architecture of USB 3.0. - View Dependent Claims (7, 8, 9, 10)
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11. An electric assembly comprising:
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a circuit board comprising a plurality of surface pads and a plurality of through vias; and an electric connector comprising; a metal housing; an insulating base connected to the metal housing; and a lead arrangement disposed on the insulating base, the lead arrangement comprising; a first lead lane comprising; a pair of first differential signal leads; a pair of second differential signal leads; and a first ground lead positioned between the two pairs of differential signal leads, wherein each of the pair of first differential signal leads, the pair of second differential signal leads and the first ground lead has a surface mounting segment soldered respectively onto the plurality of surface pads, wherein the pair of first differential signal leads is a pair of transmitting differential signal leads Tx+ and Tx−
in architecture of USB 3.0, and the pair of second differential signal leads is a pair of receiving differential signal leads Rx+ and Rx−
in architecture of USB 3.0. - View Dependent Claims (12, 13, 14, 15)
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16. An electric assembly comprising:
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a circuit board comprising a plurality of surface pads and a plurality of through vias; a signal processing unit disposed on the circuit board; and an electric connector comprising; a metal housing; an insulating base connected to the metal housing; and a lead arrangement disposed on the insulating base, the lead arrangement comprising; a first lead lane comprising; a pair of first differential signal leads; a pair of second differential signal leads; and a first ground lead positioned between the two pairs of differential signal leads, wherein each of the pair of first differential signal leads, the pair of second differential signal leads and the first ground lead has a surface mounting segment soldered respectively onto the plurality of surface pads, and wherein the signal processing unit simultaneously transmitting signals to the pair of first differential signal leads and receiving signals from the pair of second differential signal leads through the plurality of surface pads. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification