Lead arrangement, electric connector and electric assembly

• US 8,740,651 B2
• Filed: 09/13/2012
• Issued: 06/03/2014
• Est. Priority Date: 09/18/2009
• Status: Active Grant

• Current Assignee: VIA Labs Incorporated (VIA Technologies)
• Original Assignee: VIA Technologies Incorporated (VIA Technologies)
• Inventors: Lee, Sheng-Yuan
• Primary Examiner(s): ZARROLI, MICHAEL C
• Application Number:
  US13/615,578
• Publication Number:
  US 20130012067A1
• Time in Patent Office: 628 Days
• Field of Search: None
• US Class Current: 439/620.24
• CPC Class Codes: H01R 12/58 terminals for insertion into holes
• CPC Class Codes: H01R 12/724 containing contact members forming a right angle

Abstract

A lead arrangement is provided for an electric connector. The lead arrangement includes a first lead lane that includes a pair of first differential signal leads, a pair of second differential signal leads and a first ground lead between the two pairs of differential signal leads. Each of the first differential signal leads, the second differential signal leads and the ground lead has a surface mounting segment adapted for being soldered onto a surface pad of a circuit board. The pair of first differential signal leads is a pair of transmitting differential signal leads T_x⁺ and T_x⁻ in architecture of universal serial bus 3.0 (USB 3.0), and the pair of second differential signal leads is a pair of receiving differential signal leads R_x⁺ and R_x⁻ in architecture of USB 3.0.

Claims

1. A lead arrangement adapted for an electric connector, the lead arrangement comprising:

a first lead lane comprising;

a pair of first differential signal leads;

a pair of second differential signal leads; and

a first ground lead positioned between the two pairs of differential signal leads,

wherein each of the pair of first differential signal leads, the pair of second differential signal leads and the first ground lead has a surface mounting segment adapted for being soldered onto a surface pad of a circuit board,

wherein the pair of first differential signal leads is a pair of transmitting differential signal leads T_x⁺ and T_x⁻

in architecture of universal serial bus 3.0 (USB 3.0), and the pair of second differential signal leads is a pair of receiving differential signal leads R_x⁺ and R_x⁻

in architecture of USB 3.0.

2. The lead arrangement as claimed in claim 1, further comprising:

a second lead lane positioned side-by-side with the first lead lane, the second lead lane comprising;

a second ground lead;

a power lead; and

a pair of third differential signal leads positioned between the second ground lead and the power lead,

wherein each of the second ground lead, the power lead, and the pair of third differential signal leads has a via passing segment adapted for being soldered into a through via of the circuit board.

3. The lead arrangement as claimed in claim 2, wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D⁺ and D⁻

in architecture of USB 3.0 but supporting architecture of USB 1.0 or architecture of USB 2.0.

4. The lead arrangement as claimed in claim 1, further comprising:

a second lead lane comprising a first signal lead and a power lead; and

a third lead lane comprising a second signal lead and a second ground lead,

wherein the first signal lead and the second signal lead form a pair of third differential signal leads, the second lead lane and the third lead lane are positioned side-by-side with each other, and each of the second ground lead, the power lead, and the pair of third differential signal leads has a via passing segment adapted for being soldered into a through via of the circuit board.

5. The lead arrangement as claimed in claim 1, wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D⁺ and D⁻

supporting architecture of USB 1.0 or architecture of USB 2.0.

6. An electric connector comprising:

a metal housing;

an insulating base connected to the metal housing; and

a lead arrangement disposed on the insulating base, the lead arrangement comprising;

a first lead lane comprising;

a pair of first differential signal leads;

a pair of second differential signal leads; and

a first ground lead positioned between the two pairs of differential signal leads,

wherein each of the pair of first differential signal leads, the pair of second differential signal leads and the first ground lead has a surface mounting segment adapted for being soldered onto a surface pad of a circuit board,

wherein the pair of first differential signal leads is a pair of transmitting differential signal leads T_x⁺ and T_x⁻

in architecture of USB 3.0, and the pair of second differential signal leads is a pair of receiving differential signal leads R_x⁺ and R_x⁻

in architecture of USB 3.0.

7. The electric connector as claimed in claim 6, wherein the lead arrangement further comprises:

a second lead lane positioned side-by-side with the first lead lane, the second lead lane comprising;

a second ground lead;

a power lead; and

a pair of third differential signal leads positioned between the second ground lead and the power lead,

wherein each of the second ground lead, the power lead, and the pair of third differential signal leads has a via passing segment adapted for being soldered into a through via of the circuit board.

8. The electric connector as claimed in claim 7, wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D⁺ and D⁻

in architecture of USB 3.0 but supporting architecture of USB 1.0 or architecture of USB 2.0.

9. The electric connector as claimed in claim 6, wherein the lead arrangement further comprises:

a second lead lane comprising a first signal lead and a power lead; and

a third lead lane comprising a second signal lead and a second ground lead,

wherein the first signal lead and the second signal lead form a pair of third differential signal leads, the second lead lane and the third lead lane are positioned side-by-side with each other, and each of the second ground lead, the power lead, and the pair of third differential signal leads has a via passing segment adapted for being soldered into a through via of the circuit board.

10. The electric connector as claimed in claim 9, wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D⁺ and D⁻

supporting architecture of USB 1.0 or architecture of USB 2.0.

11. An electric assembly comprising:

a circuit board comprising a plurality of surface pads and a plurality of through vias; and

an electric connector comprising;

a metal housing;

an insulating base connected to the metal housing; and

a lead arrangement disposed on the insulating base, the lead arrangement comprising;

a first lead lane comprising;

a pair of first differential signal leads;

a pair of second differential signal leads; and

a first ground lead positioned between the two pairs of differential signal leads,

wherein each of the pair of first differential signal leads, the pair of second differential signal leads and the first ground lead has a surface mounting segment soldered respectively onto the plurality of surface pads,

wherein the pair of first differential signal leads is a pair of transmitting differential signal leads T_x⁺ and T_x⁻

in architecture of USB 3.0, and the pair of second differential signal leads is a pair of receiving differential signal leads R_x⁺ and R_x⁻

in architecture of USB 3.0.

12. The electric assembly as claimed in claim 11, wherein the lead arrangement further comprises:

a second lead lane positioned side-by-side with the first lead lane, the second lead lane comprising;

a second ground lead;

a power lead; and

a pair of third differential signal leads positioned between the second ground lead and the power lead,

wherein each of the second ground lead, the power lead, and the pair of third differential signal leads has a via passing segment soldered respectively into the plurality of through vias.

13. The electric assembly as claimed in claim 12, wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D⁺ and D⁻

in architecture of USB 3.0 but supporting architecture of USB 1.0 or architecture of USB 2.0.

14. The electric assembly as claimed in claim 11, wherein the lead arrangement further comprises:

a second lead lane comprising a first signal lead and a power lead; and

a third lead lane comprising a second signal lead and a second ground lead,

wherein the first signal lead and the second signal lead form a pair of third differential signal leads, the second lead lane and the third lead lane are positioned side-by-side with each other, and each of the second ground lead, the power lead, and the pair of third differential signal leads has a via passing segment adapted for being soldered into the plurality of through vias.

15. The electric assembly as claimed in claim 14, wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D⁺ and D⁻

supporting architecture of USB 1.0 or architecture of USB 2.0.

16. An electric assembly comprising:

a circuit board comprising a plurality of surface pads and a plurality of through vias;

a signal processing unit disposed on the circuit board; and

an electric connector comprising;

a metal housing;

an insulating base connected to the metal housing; and

a lead arrangement disposed on the insulating base, the lead arrangement comprising;

a first lead lane comprising;

a pair of first differential signal leads;

a pair of second differential signal leads; and

a first ground lead positioned between the two pairs of differential signal leads,

wherein each of the pair of first differential signal leads, the pair of second differential signal leads and the first ground lead has a surface mounting segment soldered respectively onto the plurality of surface pads, and

wherein the signal processing unit simultaneously transmitting signals to the pair of first differential signal leads and receiving signals from the pair of second differential signal leads through the plurality of surface pads.

17. The electric assembly as claimed in claim 16, wherein the pair of first differential signal leads is a pair of transmitting differential signal leads Tx+ and Tx−

in architecture of USB 3.0, and the pair of second differential signal leads is a pair of receiving differential signal leads Rx+ and Rx−

in architecture of USB 3.0.

18. The electric assembly as claimed in claim 16, wherein the lead arrangement further comprises:

a second lead lane positioned side-by-side with the first lead lane, the second lead lane comprising;

a second ground lead;

a power lead; and

a pair of third differential signal leads positioned between the second ground lead and the power lead,

wherein each of the second ground lead, the power lead, and the pair of third differential signal leads respectively connecting to the signal processing unit through the plurality of through vias.

19. The electric assembly as claimed in claim 18, wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D+ and D−

in architecture of USB 3.0 but supporting architecture of USB 1.0 or architecture of USB 2.0.

20. The electric assembly as claimed in claim 16, wherein the lead arrangement further comprises:

a second lead lane comprising a first signal lead and a power lead; and

a third lead lane comprising a second signal lead and a second ground lead,

wherein the first signal lead and the second signal lead form a pair of third differential signal leads, the second lead lane and the third lead lane are positioned side-by-side with each other, and each of the second ground lead, the power lead, and the pair of third differential signal leads respectively connecting to the signal processing unit through the plurality of through vias.

21. The electric assembly as claimed in claim 20, wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D+ and D−

supporting architecture of USB 1.0 or architecture of USB 2.0.