Radiation sensor and dosimeter
First Claim
Patent Images
1. A semiconductor radiation sensor, comprising:
- a substrate;
a carrier material mounted to said substrate;
conducting leads mounted on a first side of said carrier material; and
a semiconductor detector electrically coupled to the conducting leads and mounted to a second side of said carrier material, such that the substrate and the semiconductor detector are located on the second side of the carrier material;
wherein the substrate has an aperture or recess, the semiconductor detector protrudes at least partially into the aperture or recess, a radiation sensitive portion of said semiconductor detector is oriented towards said second side of the carrier material, and said carrier material is adapted to transmit radiation of interest to said radiation sensitive portion of said semiconductor detector.
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Accused Products
Abstract
A semiconductor radiation sensor (100), comprising a substrate (102), a carrier material (104) mounted to the substrate (102), and a semiconductor detector (106) mounted to the carrier material (104). A radiation sensitive portion of the semiconductor detector (106) is oriented towards the carrier material (104) and generally away from the substrate (102), and the carrier material is adapted to transmit radiation to the radiation sensitive portion of the semiconductor detector (106). A dosimeter comprising the radiation sensor (100) and a method of manufacturing the radiation sensor (100) are also provided.
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Citations
23 Claims
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1. A semiconductor radiation sensor, comprising:
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a substrate; a carrier material mounted to said substrate; conducting leads mounted on a first side of said carrier material; and a semiconductor detector electrically coupled to the conducting leads and mounted to a second side of said carrier material, such that the substrate and the semiconductor detector are located on the second side of the carrier material; wherein the substrate has an aperture or recess, the semiconductor detector protrudes at least partially into the aperture or recess, a radiation sensitive portion of said semiconductor detector is oriented towards said second side of the carrier material, and said carrier material is adapted to transmit radiation of interest to said radiation sensitive portion of said semiconductor detector. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 15)
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9. A sensor as claimed in 1, wherein the conducting leads are connected to contact pads of the semiconductor detector through apertures in the carrier material such that the conducting leads do not overlay the radiation sensitive portion of the semiconductor detector.
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10. A sensor as claimed in 1, wherein the carrier material is a tissue equivalent material.
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11. A radiation sensor, comprising:
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a semiconductor detector carrier material; conducting leads mounted on a first side of said carrier material; and a semiconductor detector electrically coupled to the conducting leads and mounted to a second side of said carrier material with a radiation sensitive portion of said semiconductor detector oriented towards said carrier material; wherein said carrier material is adapted to be mounted to a substrate with said substrate located on the second side of the carrier material and with said semiconductor detector protruding at least partially into an aperture or recess in said substrate, and said carrier material is adapted to transmit radiation of interest to said radiation sensitive portion of said semiconductor detector. - View Dependent Claims (12, 13, 14)
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16. A sensor as claimed in 11, wherein the conducting leads are connected to contact pads of the semiconductor detector through apertures in the carrier material such that the conducting leads do not overlay the radiation sensitive portion of the semiconductor detector.
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17. A sensor as claimed in 11, wherein the carrier material is a tissue equivalent material.
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18. A method of manufacturing a radiation sensor, comprising:
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mounting conducting leads on a first side of a carrier material; mounting a semiconductor detector to a second side of the carrier material with a radiation sensitive portion of said semiconductor detector oriented towards said carrier material, said carrier material being adapted to transmit radiation of interest to said radiation sensitive portion of said semiconductor detector; electrically coupling the semiconductor detector to the conducting leads; and mounting said carrier material on a substrate that has an aperture or recess, such that said semiconductor detector protrudes at least partially into said aperture or recess and the substrate is located on the second side of said carrier material. - View Dependent Claims (19, 20, 21)
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22. A method as claimed in 18, including connecting the conducting leads to contact pads of the semiconductor detector through apertures in the carrier material such that the conducting leads do not overlay the radiation sensitive portion of the semiconductor detector.
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23. A method as claimed in 18, wherein the carrier material is a tissue equivalent material.
Specification