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Semiconductor device and manufacturing method thereof

  • US 8,742,422 B2
  • Filed: 08/30/2010
  • Issued: 06/03/2014
  • Est. Priority Date: 09/04/2009
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a driver circuit in a driver circuit portion over an insulating surface and pixels in a pixel portion over the insulating surface;

    the driver circuit comprising;

    a first gate electrode layer over the insulating surface;

    a gate insulating layer over the first gate electrode layer;

    a first oxide semiconductor layer over the first gate electrode layer;

    a first source electrode layer and a first drain electrode layer over the first oxide semiconductor layer; and

    an oxide insulating layer over the first source electrode layer and the first drain electrode layer, wherein the oxide insulating layer is in contact with the first oxide semiconductor layer; and

    one of the pixels comprising;

    a second gate electrode layer over the insulating surface;

    the gate insulating layer over the second gate electrode layer;

    a second source electrode layer and a second drain electrode layer over the gate insulating layer;

    a second oxide semiconductor layer over the second gate electrode layer over the second source electrode layer and the second drain electrode layer;

    a first conductive layer over the second oxide semiconductor layer; and

    the oxide insulating layer over the second oxide semiconductor layer and the first conductive layer, wherein the oxide insulating layer is in contact with the second oxide semiconductor layer,wherein the driver circuit is arranged around the pixel portion, andwherein each of the second gate electrode layer, the gate insulating layer, the second source electrode layer, the second drain electrode layer, and the second oxide semiconductor layer has a light-transmitting property.

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