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Semiconductor component and method for producing a semiconductor component

  • US 8,742,539 B2
  • Filed: 07/27/2012
  • Issued: 06/03/2014
  • Est. Priority Date: 07/27/2012
  • Status: Active Grant
First Claim
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1. A semiconductor component comprising:

  • a semiconductor body comprising a top side and a bottom side, the top side and the bottom side being sides of the semiconductor body with the largest areas; and

    a first coil thatis monolithically integrated with the semiconductor body;

    comprises N first windings wherein N≧

    1;

    is arranged distant from the bottom side; and

    comprises a first coil axis that extends in a direction different from a surface normal of the bottom side.

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