Backplate interconnect with integrated passives

• US 8,742,570 B2
• Filed: 09/09/2011
• Issued: 06/03/2014
• Est. Priority Date: 09/09/2011
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Shenoy, Ravindra V., Mignard, Marc Maurice, Kothari, Manish, Chui, Clarence
• Primary Examiner(s): CHU, CHRIS C
• Application Number:
  US13/229,561
• Publication Number:
  US 20130063415A1
• Time in Patent Office: 998 Days
• Field of Search: 257/E27.009, 257/E27.114, 257/414, 257/419, 257431-434, 257/676, 257/679, 257/680, 257/688, 257/724, 438/107, 438/109, 438/110, 361/809, 361/784, 445/24, 445/25, 345/418
• US Class Current: 257/724
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/09 of a plurality of bonding areas
• CPC Class Codes: H01L 24/89 using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/1306 Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15788 Glasses, e.g. amorphous oxides, nitrides or fluorides

Abstract

This disclosure provides systems, methods and apparatus for manufacturing display devices having electronic components mounted within a display device package. In one aspect, the electronic component connects to the exterior of the display device through pads that run below a seal that holds a substrate and a backplate of the display device together. In another aspect the electronic components also connect to an electromechanical device within the display device, as well as connecting to pads that are external to the display device.

Claims

1. An electronic device, comprising:

a backplate having a recess;

at least one electronic component mounted in the recess and in electrical communication with one or more upper electrical traces extending from the electronic component to one or more conductive pads on the backplate;

a substrate having one or more electromechanical devices;

a seal configured to circumscribe the one or more electromechanical devices and adhere the backplate and the substrate to each other, the seal providing for a sealed area;

one or more connection pads inside the sealed area; and

one or more pads outside the sealed area, wherein

at least one of the one or more connection pads inside the sealed area has a first electrical connection with one of the one or more conductive pads on the backplate, and

at least one of the one or more connection pads inside the sealed area has a second electrical connection with one of the one or more pads outside the sealed area.

2. The electronic device of claim 1, wherein the second electrical connection passes underneath the seal.

3. The electronic device of claim 1, wherein the second electrical connection is integrated into the substrate.

4. The electronic device of claim 1, further comprising a second electronic component mounted in the recess and electrically coupled to the at least one electronic component.

5. The electronic device of claim 1, wherein the backplate is glass.

6. The electronic device of claim 1, wherein the seal includes a metal to metal seal.

7. The electronic device of claim 1, wherein the seal includes an epoxy seal.

8. The electronic device of claim 1, wherein the substrate has one or more second connection pads providing an electrical connection from the at least one electronic component to the electromechanical device.

9. The electronic device of claim 1, wherein the electromechanical device is an interferometric modulator device.

10. The electronic device of claim 1, wherein one or more pads outside the sealed area include one or more flex pads.

11. The electronic device of claim 1, further comprising:

a display;

a processor that is configured to communicate with the display, the processor being configured to process image data; and

a memory device that is configured to communicate with the processor.

12. The electronic device of claim 11, wherein the electromechanical device is the display.

13. The device of claim 11, further comprising:

a driver circuit configured to send at least one signal to the display; and

a controller configured to send at least a portion of the image data to the driver, wherein the at least one electronic component includes one of the driver circuit and the controller.

14. The device of claim 11, further comprising:

an image source module configured to send the image data to the processor.

15. The device of claim 14, wherein the image source module includes at least one of a receiver, transceiver, and transmitter and wherein the at least one electronic component includes one of the receiver, transceiver, and transmitter.

16. The device of claim 11, further comprising:

an input device configured to receive input data and to communicate the input data to the processor.

17. A method of manufacturing a display device, comprising:

etching a recess into a backplate;

depositing a conductive seed layer on the backplate;

applying a resist pattern to the backplate;

etching the conductive seed layer on the backplate;

stripping the resist pattern from the backplate;

plating the etched backplate pattern to form electrical traces from electrical component mounting pads within the etched recess to conductive pads outside the etched recess; and

mounting one or more electrical components to the mounting pads on the backplate.

18. The method of claim 17, wherein etching the recess into the backplate includes etching the recess into a glass backplate.

19. The method of claim 17, wherein depositing the conductive seed layer includes depositing a layer of aluminum.

20. The method of claim 17, wherein depositing includes at least one of colloidal metal aerosols, jet dispensed paste, sputter deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD) or evaporation.

21. The method of claim 17, wherein plating includes electroless plating.

22. The method of claim 17, wherein mounting one or more electrical components includes mounting a display driver circuit.

23. A method of manufacturing a display device, comprising:

providing a backplate having a recess and one or more electrical traces that run from electrical component mounting pads in the recess to one or more conductive pads on the backplate;

mounting at least one electrical component onto the mounting pads;

providing a substrate, the substrate having an electromechanical device, two or more connection pads, and one or more external pads, wherein at least one of the two or more connection pads are electrically connected to one of the one or more external pads; and

sealing the substrate to the backplate to form a package wherein at least one of the two or more connection pads are electrically connected to one of the one or more conductive pads, and wherein the electromechanical device and the two or more connection pads are internal to the seal and the external pads are external to the seal.

24. The method of claim 23, wherein providing the recessed backplate includes forming the one or more electrical traces on the backplate.

25. The method of claim 23, wherein providing a substrate having an electromechanical device includes providing a substrate having an interferometric modulator device.

26. The method of claim 23, wherein mounting the at least one electrical component includes mounting a display driver circuit.

27. The method of claim 23, wherein the external pads are electrically connected to the two or more connection pads by electrical traces integrated into the substrate.

28. The method of claim 23, wherein providing a substrate having the one or more external pads includes providing a substrate having one or more flex pads.

29. An electronic display device, comprising:

a backplate having a recess;

at least one electronic component mounted in the recess and in electrical communication with one or more upper electrical traces extending from the electrical component to one or more conductive pads on the backplate;

a substrate having an electromechanical device, wherein the electromechanical device is electrically connected to the electronic components;

means for sealing configured to circumscribe the electromechanical device and adhere the backplate and the substrate to each other, the seal providing for a sealed area;

one or more pads outside the sealed area; and

means for electrically connecting the one or more conductive pads on the backplate to the one or more pads outside the seal wherein at least one of the electrically connected one or more conductive pads is in electrical communication with the electromechanical device.

30. The electronic display device of claim 29, wherein the means for electrically connecting is a conductive trace.

31. The electronic display device of claim 30, wherein the conductive trace runs underneath the seal.

32. The electronic display device of claim 30, wherein the conductive trace is integrated into the substrate.

33. An electronic display device comprising:

a substrate;

a recessed backplate attached to the substrate;

one or more passive devices formed on the recessed backplate; and

a device attached inside a recess on the backplate and electrically connected to two or more leads, wherein at least one of the two or more leads is electrically connected to the one or more passive devices and another of the two or more leads is electrically connected to a pad on the substrate.

34. The device of claim 33, wherein the substrate is a printed circuit board.

35. The device of claim 33, wherein the recessed backplate is formed of glass.

36. The device of claim 33, wherein the device attached to the backplate is at least one of an application specific electrical component, a transceiver, a power management electrical component, and a microelectromechanical system.

37. The device of claim 33, wherein the one or more passive elements include one or more of a capacitor, an inductor, a resistor, and a resonator.