Sensor probe and methods of assembling same

• US 8,742,769 B2
• Filed: 01/20/2011
• Issued: 06/03/2014
• Est. Priority Date: 01/20/2011
• Status: Expired due to Fees

• Current Assignee: Baker Hughes, a GE Company, LLC (Baker Hughes Company)
• Original Assignee: General Electric Company
• Inventors: Sheikman, Boris Leonid, Lee, Yongjae
• Primary Examiner(s): Koval, Melissa
• Assistant Examiner(s): MILLER, DANIEL R
• Application Number:
  US13/010,026
• Publication Number:
  US 20120187960A1
• Time in Patent Office: 1,230 Days
• Field of Search: 324637-644, 342/458
• US Class Current: 324/642
• CPC Class Codes: G01B 15/00 Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons characterised by the use of optical techniques G01B9/00, G01B11/00
• CPC Class Codes: G01H 9/00 Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

A method of assembling a sensor probe for use in a sensor assembly is provided. The method includes providing an emitter configured to generate at least one forward propagating electromagnetic field from at least one microwave signal and to generate at least one backward propagating electromagnetic field. A data conduit is coupled to the emitter. Moreover, a ground conductor is extended substantially circumferentially about the data conduit. The ground conductor is configured to substantially reduce electromagnetic radiation within the sensor assembly.

Claims

1. A method of assembling a sensor probe for use in a sensor assembly, comprising:

providing an emitter configured to generate at least one forward propagating electromagnetic field from at least one microwave signal and to generate at least one backward propagating electromagnetic field;

coupling a data conduit to the emitter;

providing a ground conductor that extends substantially circumferentially about the data conduit, wherein the ground conductor is spaced a distance from the emitter; and

controlling the distance between the ground conductor and the emitter to be substantially equal to a quarter wavelength of a reflection of the at least one microwave signal to reduce electromagnetic radiation within the sensor assembly.

2. The method in accordance with claim 1, wherein providing a ground conductor further comprises providing a ground conductor that extends substantially circumferentially about the data conduit such that the ground conductor reflects the at least one backward propagating electromagnetic field to interact with the at least one forward propagating electromagnetic field.

3. The method in accordance with claim 1, wherein providing a ground conductor further comprises providing a ground conductor that extends substantially circumferentially about the data conduit in order to channel at least one common mode current to ground, the at least one common mode current is generated by at least one of the emitter and the data conduit.

4. The method in accordance with claim 1, further comprising coupling an emitter body to the emitter, wherein the emitter body includes an electromagnetic absorbent material applied thereon.

5. The method in accordance with claim 1, wherein providing a ground conductor further comprises providing a ground conductor that includes an electromagnetic absorbent material applied thereon.

6. The method in accordance with claim 1, wherein providing a ground conductor further comprises providing a ground conductor fabricated from a metallic material.

7. The method in accordance with claim 1, wherein providing a ground conductor further comprises providing a ground conductor that includes an upstream surface and a downstream surface spaced less than approximately 0.1 inches from the upstream surface.

8. A sensor probe for use in a sensor assembly, comprising:

an emitter configured to generate at least one forward propagating electromagnetic field from at least one microwave signal and to generate at least one backward propagating electromagnetic field;

a data conduit coupled to the emitter; and

a ground conductor extending substantially circumferentially about the data conduit, wherein the ground conductor is spaced a distance from the emitter, the distance is substantially equal to a quarter wavelength of a reflection of the at least one microwave signal, and the ground conductor is configured to reduce electromagnetic radiation within the sensor assembly based at least in part on the distance.

9. The sensor probe in accordance with claim 8, wherein the ground conductor is further configured to reflect the at least one backward propagating electromagnetic field to interact with the at least one forward propagating electromagnetic field.

10. The sensor probe in accordance with claim 8, wherein the ground conductor is further configured to channel at least one common mode current to ground, wherein the at least one common mode current is generated by at least one of the emitter and the data conduit.

11. The sensor probe in accordance with claim 8, wherein the at least one backward propagating electromagnetic field interacts with the at least one forward propagating electromagnetic field such that at least one of the strength and the amplitude of the at least one backward propagating electromagnetic field is reduced.

12. The sensor probe in accordance with claim 8, further comprising an emitter body coupled to the emitter, wherein the emitter body comprises an electromagnetic absorbent material applied thereon, and the ground conductor comprises an electromagnetic absorbent material applied thereon.

13. The sensor probe in accordance with claim 8, wherein the ground conductor is fabricated from a metallic material.

14. The sensor probe in accordance with claim 8, comprising:

a cavity about the data conduit formed by an inner sleeve disposed about the data conduit, a downstream surface of the emitter, and an upstream surface of the ground conductor; and

an electromagnetic absorbent material layer applied about the cavity to the inner sleeve, the downstream surface of the emitter, and the upstream surface of the ground conductor.

15. The sensor probe in accordance with claim 8, wherein the ground conductor comprises an upstream surface and a downstream surface spaced a predetermined distance from the upstream surface.

16. A sensor assembly comprising:

at least one sensor probe comprising;

an emitter configured to generate at least one forward propagating electromagnetic field from at least one microwave signal and to generate at least one backward propagating electromagnetic field;

a data conduit coupled to the emitter;

a ground conductor extending substantially circumferentially about the data conduit, the ground conductor configured to reduce electromagnetic radiation within the sensor assembly;

a probe housing comprising;

an outer sleeve positioned about the ground conductor; and

an inner sleeve disposed radially between the outer sleeve and the data conduit, and disposed axially between the emitter and the ground conductor, wherein the inner sleeve is configured to electromagnetically isolate the emitter from the outer sleeve; and

a signal processing device coupled to the at least one sensor probe, the signal processing device configured to generate a proximity measurement based on a loading induced to the emitter.

17. The sensor assembly in accordance with claim 16, wherein the ground conductor is further configured to reflect the at least one backward propagating electromagnetic field to interact with the at least one forward propagating electromagnetic field.

18. The sensor assembly in accordance with claim 16, wherein the ground conductor is further configured to channel at least one common mode current to ground, wherein the at least one common mode current is generated by at least one of the emitter and the data conduit.

19. The sensor assembly in accordance with claim 16, wherein the sensor probe further comprises an emitter body coupled to the emitter, the emitter body comprises an electromagnetic absorbent material applied thereon.

20. The sensor assembly in accordance with claim 16, wherein the ground conductor comprises an electromagnetic absorbent material applied thereon.