Method and system for a 60 GHz leaky wave high gain antenna

• US 8,743,002 B2
• Filed: 02/18/2010
• Issued: 06/03/2014
• Est. Priority Date: 06/09/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Primary Examiner(s): Levi, Dameon
• Assistant Examiner(s): Dawkins, Collin
• Application Number:
  US12/708,366
• Publication Number:
  US 20100309071A1
• Time in Patent Office: 1,566 Days
• Field of Search: 343/772, 343/776
• US Class Current: 343/772
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for a 60 GHz leaky wave high gain antenna are disclosed and may include communicating RF signals using one or more or more leaky wave antennas (LWAs) in a wireless device. The LWAs may be integrated in metal traces on a chip, a package, and/or a printed circuit board (PCB). The metal traces may supply voltage signals to one or more circuits on the chip, package, and/or PCB. The voltage signals may include DC bias voltages, and/or signals at a frequency that is lower than a resonant frequency of the LWAs. The LWAs may include microstrip or coplanar lines where a cavity height of the LWAs is dependent on a spacing between the lines. An angle of the wireless signals with a surface of the chip, package, and/or PCB may be dynamically configured. The LWAs may be configured via switches in the chip, package, and/or PCB.

Claims

1. A method for communication, the method comprising:

communicating RF signals using one or more leaky wave antennas in a wireless device comprising;

a plurality of circuit blocks, each electrically connected to an adjacent circuit block by a plurality of metallic traces; and

said one or more leaky wave antennas utilizing said plurality of metallic traces as a resonance cavity, wherein;

said one or more leaky wave antennas are separate from said plurality of circuit blocks;

said metal traces supply voltage signals between said plurality of circuit blocks.

2. The method according to claim 1, wherein said voltage signals comprise DC bias voltages.

3. The method according to claim 1, wherein said voltage signals comprise signals at a frequency that is lower than a resonant frequency of said leaky wave antennas.

4. The method according to claim 1, wherein said leaky wave antennas comprise microstrip lines.

5. The method according to claim 4, wherein a cavity height of said leaky wave antennas is dependent on a spacing between said microstrip lines.

6. The method according to claim 1, wherein said leaky wave antennas comprise coplanar lines.

7. The method according to claim 6, wherein a cavity height of said leaky wave antennas is dependent on a spacing between said coplanar lines.

8. The method according to claim 1, wherein said RF signals comprise 60 GHz signals.

9. The method according to claim comprising dynamically configuring an angle of said communicating of said wireless signals with a surface of said chip, said package, and/or said printed circuit board.

10. The method according to claim comprising configuring said one or more leaky wave antennas via switches in said chip, said package, and/or said printed circuit board.

11. A system for enabling communication, the system comprising:

a wireless device comprising;

a plurality of circuit blocks, each electrically connected to an adjacent circuit block by a plurality of metallic traces; and

one or more leaky wave antennas utilizing said plurality of metallic traces as a resonance cavity, wherein;

said one or more leaky wave antennas are separate from said plurality of circuit blocks;

said metal traces supply voltage signals between said plurality of circuit blocks;

said one or more leaky wave antennas being configured to communicate RF signals.

12. The system according to claim 11, wherein said voltage signals comprise DC bias voltages.

13. The system according to claim 11, wherein said voltage signals comprise signals at a frequency lower than a resonant frequency of said leaky wave antennas.

14. The system according to claim 11, wherein said leaky wave antennas comprise microstrip lines.

15. The system according to claim 11, wherein a cavity height of said leaky wave antennas is dependent on a spacing between said microstrip lines.

16. The system according to claim 11, wherein said leaky wave antennas comprise coplanar lines.

17. The system according to claim 11, wherein a cavity height of said leaky wave antennas is dependent on a spacing between said coplanar lines.

18. The system according to claim 11, wherein said RF signals comprise 60 GHz signals.

19. The system according to claim 11, wherein said plurality of circuit blocks are configured to dynamically configure an angle of said communicating of said wireless signals with a surface of said chip, package, and/or printed circuit board.

20. The system according to claim 11, wherein said plurality of circuit blocks are configured to configure said one or more leaky wave antennas via switches in said chip, said package, and/or said printed circuit board.