Planar patterned transparent contact, devices with planar patterned transparent contacts, and/or methods of making the same
First Claim
1. A method of making a coated article comprising a multi-layer thin-film coating supported by a substrate, the method comprising:
- disposing a conductive layer on the substrate;
disposing a sub-oxidized buffer layer on the conductive layer;
disposing an over-oxidized layer on the sub-oxidized buffer layer;
selectively applying energy causing oxygen in the over-oxidized layer to migrate downward into the conductive layer to increase the resistivity of the conductive layer at one or more portions,wherein, after selectively applying the energy, the multi-layer thin-film coating is substantially planar and patterned with respect to conductivity and/or resistivity.
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Accused Products
Abstract
Certain examples relate to improved methods for making patterned substantially transparent contact films, and contact films made by such methods. In certain cases, the contact films may be patterned and substantially planar. Thus, the contact films may be patterned without intentionally removing any material from the layers and/or film, such as may be required by photolithography. In certain example embodiments, an oxygen exchanging system comprising at least two layers may be deposited on a substrate, and the layers may be selectively exposed to heat and/or energy to facilitate the transfer of oxygen ions or atoms from the layer with a higher enthalpy of formation to a layer with a lower enthalpy of formation. In certain cases, the oxygen transfer may permit the conductivity of selective portions of the film to be changed. This advantageously may result in a planar contact film that is patterned with respect to conductivity and/or resistivity.
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Citations
27 Claims
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1. A method of making a coated article comprising a multi-layer thin-film coating supported by a substrate, the method comprising:
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disposing a conductive layer on the substrate; disposing a sub-oxidized buffer layer on the conductive layer; disposing an over-oxidized layer on the sub-oxidized buffer layer; selectively applying energy causing oxygen in the over-oxidized layer to migrate downward into the conductive layer to increase the resistivity of the conductive layer at one or more portions, wherein, after selectively applying the energy, the multi-layer thin-film coating is substantially planar and patterned with respect to conductivity and/or resistivity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 23, 24, 25, 26, 27)
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15. A method of making an electronic device, the method comprising:
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providing a coated article including a glass substrate supporting a multi-layer thin-film coating, the multi-layer thin-film coating comprising, moving away from the substrate; a seed layer comprising Zn, Sn, and/or an oxide thereof, a layer comprising Ag that is conductive as deposited, a sub-oxidized buffer layer, and an over-oxidized dielectric layer; defining a first set of portions in the layer comprising Ag that are to be conductive portions and a second set of portions in the layer comprising Ag that are to be substantially non-conductive portions; exposing the multi-layer thin-film coating to energy, from an energy source, in areas over the second set of portions so as to cause migration of oxygen ions or atoms from the over-oxidized dielectric layer to the layer comprising Ag and pattern the layer comprising Ag with respect to conductivity and/or resistivity; and providing the coated article having the patterned layer comprising Ag in an electronic device. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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Specification