Manufacturing method of semiconductor device
First Claim
1. A method for manufacturing a semiconductor device comprising the steps of:
- forming an oxide insulating film over a substrate, the oxide insulating film containing oxygen with a higher proportion than a proportion of oxygen in a stoichiometric composition;
forming an oxide semiconductor film over the oxide insulating film;
performing a heat treatment after forming the oxide semiconductor film;
etching a part of the oxide semiconductor film to form an island-shaped oxide semiconductor film after performing the heat treatment;
forming a pair of electrodes over the island-shaped oxide semiconductor film;
forming a gate insulating film over the island-shaped oxide semiconductor film and the pair of electrodes; and
forming a gate electrode overlapping with the island-shaped oxide semiconductor film with the gate insulating film therebetween,wherein, by the heat treatment, an amount of oxygen desorbed from the oxide insulating film is higher than or equal to 1.0×
1018 atoms/cm3.
1 Assignment
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Accused Products
Abstract
A transistor with superior electric characteristics is manufactured. An oxide insulating film is formed over a substrate, an oxide semiconductor film is formed over the oxide insulating film, heat treatment is then conducted at a temperature at which hydrogen contained in the oxide semiconductor film is desorbed and part of oxygen contained in the oxide insulating film is desorbed, then the heated oxide semiconductor film is etched into a predetermined shape to form an island-shaped oxide semiconductor film, a pair of electrodes is formed over the island-shaped oxide semiconductor film, a gate insulating film is formed over the pair of electrodes and the island-shaped oxide semiconductor film, and a gate electrode is formed over the gate insulating film.
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Citations
14 Claims
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1. A method for manufacturing a semiconductor device comprising the steps of:
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forming an oxide insulating film over a substrate, the oxide insulating film containing oxygen with a higher proportion than a proportion of oxygen in a stoichiometric composition; forming an oxide semiconductor film over the oxide insulating film; performing a heat treatment after forming the oxide semiconductor film; etching a part of the oxide semiconductor film to form an island-shaped oxide semiconductor film after performing the heat treatment; forming a pair of electrodes over the island-shaped oxide semiconductor film; forming a gate insulating film over the island-shaped oxide semiconductor film and the pair of electrodes; and forming a gate electrode overlapping with the island-shaped oxide semiconductor film with the gate insulating film therebetween, wherein, by the heat treatment, an amount of oxygen desorbed from the oxide insulating film is higher than or equal to 1.0×
1018 atoms/cm3. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacturing a semiconductor device comprising the steps of:
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forming an oxide insulating film over a substrate, the oxide insulating film containing oxygen with a higher proportion than a proportion of oxygen in a stoichiometric composition; forming a pair of electrodes over the oxide insulating film; forming an oxide semiconductor film over the pair of electrodes; performing a heat treatment after forming the oxide semiconductor film; etching a part of the oxide semiconductor film to form an island-shaped oxide semiconductor film after performing the heat treatment; forming a gate insulating film over the pair of electrodes and the island-shaped oxide semiconductor film; and forming a gate electrode overlapping with the island-shaped oxide semiconductor film with the gate insulating film therebetween, wherein, by the heat treatment, an amount of oxygen desorbed from the oxide insulating film is higher than or equal to 1.0×
1018 atoms/cm3. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification