Method for manufacturing semiconductor device

• US 8,748,240 B2
• Filed: 12/13/2012
• Issued: 06/10/2014
• Est. Priority Date: 12/22/2011
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei
• Primary Examiner(s): Sarkar, Asok K
• Application Number:
  US13/713,272
• Publication Number:
  US 20130164920A1
• Time in Patent Office: 544 Days
• Field of Search: 257/E21.143, 257/E21.468, 257/E21.632, 438/149, 438/197, 438/478, 438/479
• US Class Current: 438/149
• CPC Class Codes: H01L 2021/775 comprising a plurality of TFTs on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 21/02323 introduction of oxygen
• CPC Class Codes: H01L 21/02365 Forming inorganic semiconducting materials on a substrate for light-sensitive devices H01L31/00
• CPC Class Codes: H01L 21/02554 Oxides
• CPC Class Codes: H01L 21/02631 Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
• CPC Class Codes: H01L 21/02664 Aftertreatments planarisation in general H01L21/304
• CPC Class Codes: H01L 21/265 producing ion implantation
• CPC Class Codes: H01L 21/3105 After-treatment
• CPC Class Codes: H01L 21/477 Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering H01L21/38 - H01L21/449 and H01L21/461 - H01L21/475 take precedence
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

Oxygen vacancies in an oxide semiconductor film and the vicinity of the oxide semiconductor film are reduced and electric characteristics of a transistor including the oxide semiconductor film are improved. Further, a highly reliable semiconductor device including the transistor including the oxide semiconductor film is provided. In the transistor including the oxide semiconductor film, at least one insulating film in contact with the oxide semiconductor film contains excess oxygen. By the excess oxygen included in the insulating film in contact with the oxide semiconductor film, oxygen vacancies in the oxide semiconductor film and the vicinity of the oxide semiconductor film can be reduced. Note that the insulating film including the excess oxygen has a profile of the excess oxygen concentration having two or more local maximum values in the depth direction.

Claims

1. A method for manufacturing a semiconductor device comprising the steps of:

forming a first insulating film;

performing a first oxygen addition on the first insulating film under a first condition;

performing a second oxygen addition on the first insulating film subjected to the first oxygen addition, under a second condition; and

forming an oxide semiconductor film over the first insulating film subjected to the second oxygen addition,

wherein the first condition and the second condition are different from each other.

2. The method for manufacturing a semiconductor device according to claim 1 further comprising the step of heating the first insulating film and the oxide semiconductor film after forming the oxide semiconductor film.

3. The method for manufacturing a semiconductor device according to claim 1 further comprising the step of forming a second insulating film over the oxide semiconductor film.

4. The method for manufacturing a semiconductor device according to claim 3 further comprising the steps of:

performing a third oxygen addition on the second insulating film under a third condition; and

performing a forth oxygen addition on the second insulating film subjected to the third oxygen addition, under a forth condition.

5. The method for manufacturing a semiconductor device according to claim 1,

wherein a depth in the first insulating film at which the largest value of a concentration of oxygen added under the first condition appears is different from a depth in the first insulating film at which the largest value of a concentration of oxygen added under the second condition appears.

6. The method for manufacturing a semiconductor device according to claim 1,

wherein the first condition is an acceleration voltage of higher than or equal to 10 kV and lower than or equal to 100 kV by an ion implantation method, and

wherein the second condition is an acceleration voltage of higher than or equal to 1 kV and lower than 10 kV by an ion implantation method.

7. The method for manufacturing a semiconductor device according to claim 1,

wherein the first insulating film is formed over a substrate,

wherein the first condition is an acceleration voltage of higher than or equal to 10 kV and lower than or equal to 100 kV by an ion implantation method with, and

wherein the second condition is a bias voltage of higher than or equal to 10 V and lower than 1 kV to the substrate side in plasma comprising oxygen by a voltage application method.

8. A method for manufacturing a semiconductor device comprising the steps of:

forming a gate electrode;

forming a gate insulating film over the gate electrode;

performing a first oxygen addition on the gate insulating film under a first condition;

performing a second oxygen addition on the gate insulating film subjected to the first oxygen addition, under a second condition; and

forming an oxide semiconductor film overlapping with the gate electrode with the gate insulating film interposed therebetween after the second oxygen addition is performed,

wherein the first condition and the second condition are different from each other.

9. The method for manufacturing a semiconductor device according to claim 8 further comprising the step of heating the gate insulating film and the oxide semiconductor film after forming the oxide semiconductor film.

10. The method for manufacturing a semiconductor device according to claim 8 further comprising the step of forming a protective insulating film over the oxide semiconductor film.

11. The method for manufacturing a semiconductor device according to claim 10 further comprising the steps of:

performing a third oxygen addition on the protective insulating film under a third condition; and

performing a forth oxygen addition on the protective insulating film subjected to the third oxygen addition, under a forth condition.

12. The method for manufacturing a semiconductor device, according to claim 8,

wherein a depth in the gate insulating film at which the largest value of a concentration of oxygen added under the first condition appears is different from a depth in the gate insulating film at which the largest value of a concentration of oxygen added under the second condition appears.

13. The method for manufacturing a semiconductor device according to claim 8,

wherein the first condition is an acceleration voltage of higher than or equal to 10 kV and lower than or equal to 100 kV by an ion implantation method, and

wherein the second condition is an acceleration voltage of higher than or equal to 1 kV and lower than 10 kV by an ion implantation method.

14. The method for manufacturing a semiconductor device according to claim 8,

wherein the gate electrode is formed over a substrate,

wherein the first condition is an acceleration voltage of higher than or equal to 10 kV and lower than or equal to 100 kV by an ion implantation method, and

wherein the second condition is a bias voltage of higher than or equal to 10 V and lower than 1 kV to the substrate side in plasma comprising oxygen by a voltage application method.