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Systems and methods for separating components of a multilayer stack of electronic components

  • US 8,748,324 B1
  • Filed: 02/26/2013
  • Issued: 06/10/2014
  • Est. Priority Date: 02/26/2013
  • Status: Active Grant
First Claim
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1. A method of separating an electronic assembly from a multilayer stack of electronic components that includes the electronic assembly, a substrate, and a sacrificial anode portion that is located between the electronic assembly and the substrate and that operatively attaches the electronic assembly to the substrate, wherein the electronic assembly includes a cathode portion and a device portion, the method comprising:

  • locating the multilayer stack within an electrically conductive fluid to form an electrochemical cell;

    generating a potential difference between the cathode portion and the sacrificial anode portion such that the cathode portion forms a cathode of the electrochemical cell and the sacrificial anode portion forms an anode of the electrochemical cell; and

    separating the electronic assembly from the substrate by electrochemically oxidizing the sacrificial anode portion to dissolve the sacrificial anode portion within the electrically conductive fluid.

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