Systems and methods for separating components of a multilayer stack of electronic components
First Claim
1. A method of separating an electronic assembly from a multilayer stack of electronic components that includes the electronic assembly, a substrate, and a sacrificial anode portion that is located between the electronic assembly and the substrate and that operatively attaches the electronic assembly to the substrate, wherein the electronic assembly includes a cathode portion and a device portion, the method comprising:
- locating the multilayer stack within an electrically conductive fluid to form an electrochemical cell;
generating a potential difference between the cathode portion and the sacrificial anode portion such that the cathode portion forms a cathode of the electrochemical cell and the sacrificial anode portion forms an anode of the electrochemical cell; and
separating the electronic assembly from the substrate by electrochemically oxidizing the sacrificial anode portion to dissolve the sacrificial anode portion within the electrically conductive fluid.
1 Assignment
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Accused Products
Abstract
Systems and methods for separating components of a multilayer stack of electronic components. The multilayer stack includes an electronic assembly, a substrate, and a sacrificial anode portion that is located between the electronic assembly and the substrate and that operatively attaches the electronic assembly to the substrate. The systems and methods may include locating the multilayer stack within an electrically conductive fluid to form an electrochemical cell. The systems and methods further may include generating a potential difference between a cathode portion of the electronic assembly and the sacrificial anode portion such that the cathode portion forms a cathode of the electrochemical cell and the sacrificial anode portion forms an anode of the electrochemical cell. The systems and methods additionally may include separating the electronic assembly from the substrate by electrochemically oxidizing the sacrificial anode portion to dissolve the sacrificial anode portion within the electrically conductive solution.
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Citations
20 Claims
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1. A method of separating an electronic assembly from a multilayer stack of electronic components that includes the electronic assembly, a substrate, and a sacrificial anode portion that is located between the electronic assembly and the substrate and that operatively attaches the electronic assembly to the substrate, wherein the electronic assembly includes a cathode portion and a device portion, the method comprising:
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locating the multilayer stack within an electrically conductive fluid to form an electrochemical cell; generating a potential difference between the cathode portion and the sacrificial anode portion such that the cathode portion forms a cathode of the electrochemical cell and the sacrificial anode portion forms an anode of the electrochemical cell; and separating the electronic assembly from the substrate by electrochemically oxidizing the sacrificial anode portion to dissolve the sacrificial anode portion within the electrically conductive fluid. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A multilayer stack of electronic materials, comprising:
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a substrate; a sacrificial anode portion; and an electronic assembly wherein the sacrificial anode portion is located between the electronic assembly and the substrate and operatively attaches the electronic assembly to the substrate, and further wherein the electronic assembly includes; a sacrificial photovoltaic cell that is in electrical communication with the sacrificial anode portion; a cathode portion that is in electrical communication with the sacrificial photovoltaic cell, wherein the sacrificial photovoltaic cell electrically separates the cathode portion from the sacrificial anode portion; and a device portion, wherein the sacrificial photovoltaic cell is located between the substrate and the device portion. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification