Compact proximity sensor suppressing internal reflection
First Claim
Patent Images
1. A proximity sensor comprising:
- a sensor package having an attachment pad;
a radiation source and a radiation detector housed within the sensor package using a substantially transparent over-molding, the source and the detector being held in a fixed relation to the attachment pad, wherein a portion of the attachment pad is adapted to form a baffle which forms at least part of an optical isolator, and wherein the baffle comprises material at least partially cut out from the pad, the optical isolator adapted to substantially prevent internal reflection within the substantially transparent over-molding between the source and the detector, and wherein at least one of the source and detector are one of directly and indirectly mounted on the attachment pad.
1 Assignment
0 Petitions
Accused Products
Abstract
A proximity sensor includes a sensor package having an attachment pad with a radiation source and a radiation detector housed within the sensor package. The source and the detector are held in a fixed relation to the attachment pad, and are mounted by one of a direct or indirect attachment to the attachment pad. A portion of the attachment pad is adapted to form a baffle which forms at least part of an optical isolator. The optical isolator is adapted to substantially prevent the internal propagation of radiation between the source and the detector within the sensor package.
38 Citations
35 Claims
-
1. A proximity sensor comprising:
- a sensor package having an attachment pad;
a radiation source and a radiation detector housed within the sensor package using a substantially transparent over-molding, the source and the detector being held in a fixed relation to the attachment pad, wherein a portion of the attachment pad is adapted to form a baffle which forms at least part of an optical isolator, and wherein the baffle comprises material at least partially cut out from the pad, the optical isolator adapted to substantially prevent internal reflection within the substantially transparent over-molding between the source and the detector, and wherein at least one of the source and detector are one of directly and indirectly mounted on the attachment pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
- a sensor package having an attachment pad;
-
21. A proximity sensor comprising:
- a sensor package having an attachment pad;
a radiation source and a radiation detector housed within the sensor package using an over-molding, the source and the detector being held in a fixed relation to the attachment pad, wherein a portion of the attachment pad is adapted to form a baffle which forms at least part of an optical isolator, the optical isolator adapted to substantially prevent internal reflection between the source and the detector within the sensor package, wherein the over-molding comprises a trench formed above or adjacent the baffle, the trench forming part of the optical isolator, and wherein at least one of the source and detector are one of directly and indirectly mounted on the attachment pad. - View Dependent Claims (22, 23, 24, 25, 26, 27)
- a sensor package having an attachment pad;
-
28. A method of manufacturing a radiation sensor, the method comprising:
-
(a) holding a radiation source and a radiation detector in fixed relation to an attachment pad of a sensor package using a substantially transparent over-molding, at least one of the radiation source and the radiation detector being one of directly and indirectly mounted on the attachment pad; and (b) adapting a portion of the attachment pad to form a baffle which forms at least part of an optical isolator, wherein the baffle comprises material at least partially cut from the attachment pad, the optical isolator substantially preventing internal reflection within the substantially transparent over-molding between the source and the detector within the sensor package. - View Dependent Claims (29, 33, 34, 35)
-
-
30. A method of manufacturing a radiation sensor, the method comprising:
-
(a) holding a radiation source and a radiation detector in fixed relation to an attachment pad of a sensor package, at least one of the radiation source and the radiation detector being one of directly and indirectly mounted on the attachment pad; and (b) partially cutting out material from the attachment pad to form a baffle which forms at least part of an optical isolator, the optical isolator substantially preventing internal propagation of radiation between the source and the detector within the sensor package. - View Dependent Claims (31)
-
-
32. A method of manufacturing a radiation sensor, the method comprising:
-
(a) holding a radiation source and a radiation detector in fixed relation to an attachment pad of a sensor package, at least one of the radiation source and the radiation detector being one of directly and indirectly mounted on the attachment pad; and (b) partially cutting out material from a portion of the attachment pad adjacent the source; and (c) bending the partially cut out material upwards towards the detector to form an optical isolator substantially preventing internal propagation of radiation between the source and the detector within the sensor package.
-
Specification