Common optical element for an array of phosphor converted light emitting devices
First Claim
1. An apparatus comprising:
- a submount;
a plurality of light emitting device dice mounted to the submount; and
a single optical element attached to the plurality of light emitting device dice, wherein the single optical element is attached to the plurality of light emitting device dice by bonding the single optical element to a surface of each of the plurality of light emitting device dice.
6 Assignments
0 Petitions
Accused Products
Abstract
A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.
104 Citations
18 Claims
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1. An apparatus comprising:
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a submount; a plurality of light emitting device dice mounted to the submount; and a single optical element attached to the plurality of light emitting device dice, wherein the single optical element is attached to the plurality of light emitting device dice by bonding the single optical element to a surface of each of the plurality of light emitting device dice. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A device comprising:
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a semiconductor light emitting device comprising a stack of semiconductor layers including an active region; an optical element bonded to the semiconductor light emitting device, wherein the optical element comprises a material selected from the group of aluminum oxynitride, spinel, and transparent alumina; a bonding layer disposed between the optical element and the semiconductor light emitting device, wherein the bonding layer comprises an oxide of tellurium; and
a submount electrically connected to the light emitting device. - View Dependent Claims (11, 12, 13)
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14. A device comprising:
- -4- Ser. No. 13/288,291 a semiconductor light emitting device comprising a stack of semiconductor layers including an active region;
an optical element bonded to the semiconductor light emitting device, wherein the optical element comprises a material selected from the group of aluminum oxynitride, spinel, and transparent alumina; and
a bonding layer disposed between the optical element and the semiconductor light emitting device, wherein the bonding layer comprises a material selected from the group of an oxide of lead, an oxide of tungsten, and an oxide of zinc. - View Dependent Claims (15, 16, 17, 18)
- -4- Ser. No. 13/288,291 a semiconductor light emitting device comprising a stack of semiconductor layers including an active region;
Specification