Emitter package with angled or vertical LED

• US 8,748,915 B2
• Filed: 08/25/2010
• Issued: 06/10/2014
• Est. Priority Date: 04/24/2006
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Hong Kong Limited (Wolfspeed, Inc.), CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Chan, Alex Chi Keung, Emerson, David Todd
• Primary Examiner(s): Smith, Zandra
• Assistant Examiner(s): PATTON, PAUL E
• Application Number:
  US12/868,567
• Publication Number:
  US 20110042698A1
• Time in Patent Office: 1,385 Days
• Field of Search: 257/91, 257/98, 257/E33.067, 257/E33.058
• US Class Current: 257/91
• CPC Class Codes: C09K 11/7731 with alkaline earth metals
• CPC Class Codes: C09K 11/7774 Aluminates
• CPC Class Codes: G02B 6/0023 provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
• CPC Class Codes: G02B 6/0068 Arrangements of plural sources, e.g. multi-colour light sources
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/52 Encapsulations

Abstract

The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis. LED displays according to the present invention comprise a plurality of LED packages, at least some of which have an LED chip mounted in a reflective cup at different angles to achieve the desired display FFP.

Claims

1. A light emitting diode (LED) package, comprising:

a reflective cup and an LED chip mounted in said reflective cup, wherein said reflective cup has a first axis and a second axis orthogonal to said first axis, wherein said LED chip is rotated within said reflective cup so that said LED chip is out of alignment with said first axis; and

a substrate with said LED chip and said reflective cup mounted on said substrate;

wherein said LED chip has a chip long axis, said chip long axis normal to said first axis.

2. The LED package of claim 1, wherein said LED chip is out of alignment with said second axis.

3. The LED package of claim 1, wherein said LED chip has edges, wherein said edges are out of alignment with said first and second axis.

4. The LED package of claim 1, wherein said LED chip is aligned with said second axis.

5. The LED package of claim 1, wherein said reflective cup is oval shaped.

6. The LED package of claim 5, wherein said LED chip is rectangular shaped.

7. The LED package of claim 5, wherein said first axis is said oval shaped reflector cup'"'"'s longitudinal axis, said LED chip aligned with said second axis.

8. The LED package of claim 1, wherein said reflective cup is circular.

9. The LED package of claim 1, wherein said LED chip is out of alignment with said first axis at an angle between 0 and 90 degrees.

10. The LED package of claim 1, wherein said LED chip is out of alignment with said first axis at an angle of approximately 45 degrees.

11. The LED package of claim 1, wherein said LED chip is part of an array of LED chips.

12. The LED package of claim 1, emitting a far-field pattern having a 50% emission intensity angle that is wider than the same LED package wherein said LED chip is aligned with said first axis.

13. The LED package of claim 1, further comprising a lens over said LED chip.

14. An light emitting diode (LED) package, comprising:

a substrate and an LED chip mounted on said substrate, wherein said substrate has a first longitudinal axis, and wherein said LED chip is mounted on said substrate so that said LED chip is out of alignment with said first axis,

further comprising a reflective cup on said substrate,

wherein said LED package emits a far-field pattern having a 50% emission intensity angle that is wider than when said LED chip is aligned with said first axis.

15. The LED package of claim 14, further comprising a lens over said LED chip.

16. The LED package of claim 15, wherein said first axis runs between the contacts on said substrate.

17. The LED package of claim 14, further comprising a second axis that is orthogonal to said first axis wherein said LED chip is out of alignment with said second axis.

18. The LED package of claim 17, wherein said LED chip is aligned with said second axis.

19. The LED package of claim 17, wherein said LED chip is out of alignment with said first axis at an angle between 0 and 90 degrees.

20. The LED package of claim 17, wherein said LED chip is out of alignment with said first axis at an angle of approximately 45 degrees.

21. The LED package of claim 17, wherein said LED chip is part of an array of LED chips.

22. An light emitting diode (LED) package, comprising:

a rectangular LED chip having a chip longitudinal axis;

an oval shaped reflective cup having a cup longitudinal axis, said LED chip mounted within said reflective cup with said chip longitudinal axis normal to said cup longitudinal axis; and

a substrate with said LED chip and said reflective cup mounted on said substrate.

23. The LED package of claim 22, wherein said chip longitudinal axis is orthogonal to said cup longitudinal axis.

24. The LED package of claim 22, wherein said LED chip is part of an array of LED chips.

25. The LED package of claim 22, emitting a far-field pattern having a 50% emission intensity angle that is wider than the same LED package wherein said chip longitudinal axis is aligned with said cup longitudinal axis.

26. The LED package of claim 22, further comprising a lens over said LED chip.

27. A light emitting diode (LED) display, comprising:

a plurality of LED packages, at least some of which have an LED chip mounted in a reflective cup, said package having a first axis that is orthogonal to a second axis, said LED chip mounted out of alignment with said first axis; and

a substrate with said LED chip and said reflective cup mounted on said substrate;

wherein each LED package emits a far-field pattern having a 50% emission intensity angle that is wider than when said LED chip is aligned with said first axis.

28. The display of claim 27, wherein said LED chip is out of alignment with said second axis.

29. The display of claim 27, wherein said LED chip has edges, wherein said edges are out of alignment with said first and second axis.

30. The display of claim 27, wherein said LED chip is aligned with said second axis.

31. The display of claim 27, wherein each said reflective cup is oval shaped.

32. The display of claim 31, wherein each said LED chip is rectangular shaped.

33. The display of claim 31, wherein said first axis is said oval shaped reflector cup'"'"'s longitudinal axis, said LED chip aligned with said second axis.

34. The display of claim 27, wherein said reflective cup is circular.

35. The display of claim 27, wherein each said LED chip is out of alignment with said first axis at an angle between 0 and 90 degrees.

36. The display of claim 27, wherein each said LED chip is out of alignment with said first axis at an angle of approximately 45 degrees.

37. The display of claim 27, wherein each said each said LED chip is part of an array of LED chips.

38. An emitter, comprising;

an LED chip mounted within a package, wherein said LED chip has a chip tong axis and said package has a package long axis, wherein the said chip long axis is oriented differently than said package long axis;

wherein said LED chip emits a far-field pattern having a 50% emission intensity angle that is wider than when said chip long axis is aligned with said package long axis.

39. A light emitting diode (LED) package, comprising:

an LED chip on a submount or a reflective cup; and

a lens over said LED chip, wherein said lens has a first axis and a second axis orthogonal to said first axis, wherein said LED chip is on said submount or reflective with said LED chip out of alignment with said first axis;

wherein said LED package emits a far-field pattern having a 50% emission intensity angle that is wider than when said LED chip is aligned with said first axis.

40. The LED package of claim 39, wherein said LED chip is also out of alignment with said second axis.