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Light-emitting dies incorporating wavelength-conversion materials and related methods

  • US 8,748,929 B2
  • Filed: 11/20/2013
  • Issued: 06/10/2014
  • Est. Priority Date: 01/24/2012
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a solid shaped volume of a polymeric binder;

    suspended within the polymeric binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a bare-die light-emitting element comprising a plurality of active semiconductor layers that cooperatively emit light;

    a reflecting layer disposed on a surface of the polymeric binder or disposed within at least a portion of the polymeric binder proximate the semiconductor die; and

    disposed on the first face of the semiconductor die, at least two spaced-apart contacts each (i) having a free terminal end not covered by the polymeric binder, (ii) being available for electrical connection, and (iii) contacting a different active semiconductor layer of the semiconductor die,wherein (i) at least a portion of the polymeric binder is transparent to a wavelength of light emitted by the light-emitting element and (ii) the reflecting layer has a reflectivity of at least 50% to a wavelength of light emitted by the light-emitting element within the polymeric binder.

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