Sensor module

• US 8,748,998 B2
• Filed: 08/09/2011
• Issued: 06/10/2014
• Est. Priority Date: 08/09/2010
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Frey, Jens, Weber, Heribert, Graf, Eckhard
• Primary Examiner(s): Sengdara, Vongsavanh
• Assistant Examiner(s): MUSE, ISMAIL A
• Application Number:
  US13/206,024
• Publication Number:
  US 20120032283A1
• Time in Patent Office: 1,036 Days
• Field of Search: 257/226, 257/619, 257685-686, 735/143.2, 438/51, 438/55, 438/64, 438106-127
• US Class Current: 257/415
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: G01L 19/0076 using buried connections
• CPC Class Codes: G01L 19/0092 Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26
• CPC Class Codes: G01L 9/0048 Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
• CPC Class Codes: G01L 9/0052 of piezoresistive elements circuits therefor G01L9/06
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01R 33/0286 comprising microelectromechanical systems [MEMS] MEMS devices in general B81B

Abstract

A sensor module includes a substrate system which has multiple substrates situated one on top of the other and connected in each case via a wafer bond connection. The substrate system includes at least one first sensor substrate and at least one second sensor substrate, the first sensor substrate having a first sensor structure and the second sensor substrate having a second sensor structure. The first and second sensor structures are designed for detecting different characteristics. At least the first sensor structure includes a micromechanical functional structure. Moreover, a method for manufacturing such a sensor module is disclosed.

Claims

1. A sensor module, comprising:

a substrate system including multiple substrates situated one on top of the other and connected in each case via a wafer bond connection, multiple substrates including at least one first sensor substrate and at least one second sensor substrate, the first sensor substrate having a first sensor structure and the second sensor substrate having a second sensor structure, the first and second sensor structures being configured to detect different characteristics with respect to each other, at least the first sensor structure including a micromechanical functional structure,

wherein contact plungers contacting the substrate system and situated at different levels of the substrate system are provided in the form of a feedthrough structure enclosed by a trench structure and containing material of at least two different substrates of the substrate system.

2. The sensor module as recited in claim 1, wherein the trench structure is filled with a filling material.

3. The sensor module as recited in claim 1, wherein the contact plungers are contactable from the same or different sides of the substrate system.

4. The sensor module as recited in claim 1, wherein the substrate system includes an additional substrate the additional substrate situated between the first and second sensor substrates or on one side of the substrate system.

5. The sensor module as recited in claim 4, wherein the additional substrate includes integrated circuit structures which are electrically connected to the sensor structures of the first and second sensor substrates.

6. The sensor module as recited in claim 1, wherein at least one of (a) the first sensor substrate and (b) the second sensor substrate is configured to detect at least one of (a) acceleration, (b) yaw rate, (c) pressure, (d) magnetic field, (e)temperature, and (f) infrared radiation.

8. The sensor module as recited in claim 1, wherein at least one of (a) the first sensor substrate and (b) the second sensor substrate is configured to detect at least one of (a) acceleration, (b) yaw rate, (c) pressure, (d) magnetic field, and (e) temperature.

7. A method for manufacturing a sensor module, comprising:

connecting multiple substrates with the aid of wafer bonding to form a substrate system composed of the multiple substrates situated one on top of the other, the substrate system including at least one first sensor substrate and at least one second sensor substrate, the first sensor substrate having a first sensor structure and the second sensor substrate having a second sensor structure, the first and second sensor structures being configured to detect different characteristics with respect to each other, at least the first sensor structure including a micromechanical functional structure,

wherein contact plungers contacting the substrate system and situated at different levels of the substrate system are provided in the form of a feedthrough structure enclosed by a trench structure and containing material of at least two different substrates of the substrate system.