Microchip with blocking apparatus and method of fabricating microchip
First Claim
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1. A microchip comprising:
- a base die having a top surface with an exposed conductive interconnect, the base die also having an isolation trench around at least a portion of the conductive interconnect, the base die also having two opposed sides, the opposed sides comprising a first side and a second side, the conductive interconnect being positioned closer to the first side than it is to the second side;
a cap die secured to the base die;
a seal between the base and the cap, the seal securing the base die with the cap die, the seal comprising a metal material; and
a blocking trench formed in the base die between the isolation trench and the seal, the blocking trench being formed between the first side and the isolation trench, the blocking trench for at least in part preventing the metal material from electrically contacting the interconnect with the seal,wherein the blocking trench contains metal material having substantially the same composition as the seal.
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Abstract
A microchip has a base die with a conductive interconnect and an isolation trench around at least a portion of the conductive interconnect, and a cap die secured to the base die. A seal, formed from a metal material, is positioned between the base die and the cap die to secure them together. The microchip also has a blocking apparatus, between the isolation trench and the metal seal, that at least in part prevents the metal material from contacting the interconnect.
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Citations
7 Claims
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1. A microchip comprising:
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a base die having a top surface with an exposed conductive interconnect, the base die also having an isolation trench around at least a portion of the conductive interconnect, the base die also having two opposed sides, the opposed sides comprising a first side and a second side, the conductive interconnect being positioned closer to the first side than it is to the second side; a cap die secured to the base die; a seal between the base and the cap, the seal securing the base die with the cap die, the seal comprising a metal material; and a blocking trench formed in the base die between the isolation trench and the seal, the blocking trench being formed between the first side and the isolation trench, the blocking trench for at least in part preventing the metal material from electrically contacting the interconnect with the seal, wherein the blocking trench contains metal material having substantially the same composition as the seal. - View Dependent Claims (2, 3, 4, 5)
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6. A microchip comprising:
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a base die having a top surface with an exposed conductive interconnect, the base die also having an isolation trench around at least a portion of the conductive interconnect; a cap die secured to the base die; a seal between the base and the cap, the seal securing the base die with the cap die, the seal comprising a metal material; and a protrusion extending downwardly from the cap die, the protrusion being spaced from and not contacting the base die, the protrusion being between the conductive interconnect and the seal, the protrusion at least in part preventing the metal material from electrically contacting the interconnect with the seal, wherein the protrusion is in contact with metal material having substantially the same composition as the seal. - View Dependent Claims (7)
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Specification