Mobile terminal

• US 8,749,980 B2
• Filed: 01/28/2011
• Issued: 06/10/2014
• Est. Priority Date: 01/29/2010
• Status: Expired due to Fees

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: Won, Dongsu, Cho, Yongsang, Jang, Seunghwan
• Primary Examiner(s): SMITH, COURTNEY L
• Application Number:
  US13/016,908
• Publication Number:
  US 20110188207A1
• Time in Patent Office: 1,229 Days
• Field of Search: 361676-678, 36167946-67954, 361688-690, 361701-722, 361760-762, 361807-812, 361/831
• US Class Current: 361/710
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04B 1/036 Cooling arrangements
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 5/0278 of USB type details relating to connectors H01R27/00

Abstract

A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector.

Claims

1. A mobile terminal comprising:

a case;

a first element that generates heat;

a connector configured to connect to another device to provide a data exchange path between the first element and the another device;

a thermal conduction frame having one side coming into thermal contact with the first element and another side coming into thermal contact with the connector to transfer the heat generated by the first element to the connector; and

at least one plate-shaped thermal insulator located inside the case to prevent transfer of the heat generated by the first element to the case.

2. The mobile terminal of claim 1, further comprising a first board on which the first element is mounted, the first board being combined with the thermal conduction frame.

3. The mobile terminal of claim 2, wherein the first board is an upper board, and wherein the mobile terminal further comprises:

a second element that generates heat; and

a lower board on which the second element is mounted, wherein the thermal conduction frame is plate-shaped and is located between the upper board and the lower board.

4. The mobile terminal of claim 2, wherein the first element faces the thermal conduction frame.

5. The mobile terminal of claim 3, wherein the thermal conduction frame includes a shielding rib projecting from the thermal conduction frame to correspond to the first element to prevent electromagnetic waves generated by the first element from being diffused.

6. The mobile terminal of claim 2, wherein the first board is an upper board, and wherein the mobile terminal further comprises:

a second element that generates heat;

a lower board on which the second element is mounted, wherein the thermal conduction frame is plate-shaped and is located between the upper board and the lower board; and

a second thermal conduction frame formed in a plate-shape and located between at least one of the upper board or the lower board and the first thermal conduction frame.

7. The mobile terminal of claim 2, wherein the first board is combined with the thermal conduction frame through at least one combining hook extended from the thermal conduction frame.

8. The mobile terminal of claim 1, wherein the another side of the thermal conduction frame is pressed against at least one side of the connector.

9. The mobile terminal of claim 1, wherein the connector transfers heat received from the thermal conduction frame to the another device.

10. The mobile terminal of claim 1, wherein the thermal conduction frame generates a thermal gradient between the first element and the connector.

11. The mobile terminal of claim 1, wherein the thermal conduction frame is made of one of aluminum, aluminum alloy, copper, or copper alloy.

12. The mobile terminal of claim 1, wherein the connector is a USB connector for connecting to a USB port of the another device.

13. The mobile terminal of claim 1, wherein the first element is at least one of a communication chip including a modem chip, an RF transmitter chip, an RF receiver chip, or a power chip, wherein the power chip includes a power amplifier chip and a power management IC chip.

14. The mobile terminal of claim 1, wherein the thermal conduction frame and the first element are bonded to each other using an adhesive material including thermal grease.

15. A mobile terminal comprising:

a case;

a first element that generates heat;

a connector configured to connect to another device to provide a data exchange path between the first element and the another device;

a thermal conduction frame having one side coming into thermal contact with the connector and another side coming into thermal contact with at least part of the first element to transfer the heat generated by the first element to the connector; and

at least one plate-shaped insulator provided inside the case to prevent transfer of the heat generated by the first element to the case.

16. The mobile terminal of claim 15, further comprising a first board on which the first element is mounted, the first board being combined with the thermal conduction frame.

17. The mobile terminal of claim 15, wherein the thermal conduction frame includes a shielding rib projecting from the thermal conduction frame to correspond to the first element to prevent electromagnetic waves generated by the first element from being diffused.

18. The mobile terminal of claim 16, wherein the first board is combined with the thermal conduction frame through at least one combining hook extended from the thermal conduction frame.

19. The mobile terminal of claim 15, wherein the one side of the thermal conduction frame is pressed against at least one side of the connector.

20. The mobile terminal of claim 15, wherein the connector is a USB connector for connecting to a USB port of the another device.

21. The mobile terminal of claim 15, wherein the another side of the thermal conduction frame is bonded to the first element using an adhesive material including thermal grease.