Implantable medical device having a multi-axis magnetic sensor

• US 8,750,961 B1
• Filed: 03/07/2013
• Issued: 06/10/2014
• Est. Priority Date: 03/07/2013
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Ries, Andrew J., Henschel, Mark E., McClure, Lawrence C., Ricotta, Mark S., Wang, Lejun
• Primary Examiner(s): Gedeon, Brian T
• Application Number:
  US13/788,310
• Time in Patent Office: 460 Days
• Field of Search: None
• US Class Current: 600/407
• CPC Class Codes: A61B 5/055 involving electronic [EMR] or nuclear [NMR] magnetic resonance, e.g. magnetic resonance imaging
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents

Abstract

The present invention provides a packaging technique and apparatus that incorporates a flexible substrate package with a three-axis magnetic sensor for three-axis sensing in an implantable medical device. The apparatus includes three single-axis magnetic sensor integrated circuits (ICs) that are mounted to a substrate and encapsulated with a polymer mold compound. The substrate is excised around each of the sensor ICs to form panels that are folded to align the three single-axis sensors in the x, y and z axis.

Claims

1. An implantable medical device, comprising:

a multi-dimensional magnetic sensor including;

a substrate having a plurality of panels, each panel being separable from the others of the panels;

three hall sensors positioned on each of the plurality of panels, each of the panels having at least one subpanel that is foldable, wherein the folding of the at least one subpanel allows the hall sensors to be oriented along three independent axis.

2. The implantable medical device of claim 1, wherein the multi-dimensional magnetic sensor is configured to detect an exposure of the implantable medical device to a magnetic field in at least one of the three axis.

3. The implantable medical device of claim 2, wherein a mode of operation of the implantable medical device is adjustable in response to detection of a magnetic field.

4. The implantable medical device of claim 3, wherein the adjustment of the mode of operation is selected from a list including at least one of:

a first operating mode when a magnitude of the magnetic field is below a specified first threshold;

a second operating mode when the magnitude of the magnetic field exceeds or equals the specified first threshold over a specified first duration;

or

a third operating mode when the magnitude of the magnetic field further exceeds or equals a specified second threshold over a specified second duration.

5. The implantable medical device of claim 4, wherein:

the first operating mode includes an ambulatory operating mode, the second operating mode includes a battery status test mode in which the implantable medical device is configured to provide an indication to a user corresponding to a battery status;

and the third operating mode includes a magnetic resonance imaging (MRI) safe mode.

6. The implantable medical device of claim 2, wherein detecting the exposure of the implantable medical device to the magnetic field includes monitoring at least one of a current and a voltage provided by at least one of the three hall sensors.

7. The implantable medical device of claim 1, wherein the folding of the at least one subpanel orients the hall sensors along three mutually orthogonal axis.

8. The implantable medical device of claim 1, further comprising an electrical interface connector disposed on a third subpanel including terminals for coupling the three hall sensors to a processor.

9. The implantable medical device of claim 1, further comprising electrical traces formed in each of the subpanels and coupling the three hall sensors to an electrical interface connector.

10. The implantable medical device of claim 1, further comprising circuitry to combine the output of each of the three hall sensors to obtain an indicator of a magnetic field, wherein the circuitry includes a semiconductor OR gate electrically coupled to each of the three hall sensors.

11. A method for forming a magnetic sensor package, comprising:

providing a substrate having a first surface configured for mounting a plurality of hall sensors and a second surface having pads for electrical coupling to an implantable medical device circuit hybrid;

electrically coupling the plurality of hall sensors to the substrate;

fixating each of the plurality of hall sensors onto the substrate;

excising a panel of the substrate including at least three of the plurality of hall sensors, wherein the panel includes at least three subpanels; and

folding one of the at least three subpanels to orient the at least three hall sensors along three independent axis.

12. The method of claim 11, further comprising molding the at least three hall sensors of each panel in the folded configuration to permanently orient the three subpanels in a mutually orthogonal orientation.

13. The method of claim 12, wherein the molding is performed subsequent to excising the subpanel and folding of two of the at least three subpanels.

14. The method of claim 13, further comprising placing the base substrate onto a mold fixture prior to performing the molding.

15. The method of claim 11, further comprising reflowing each of the plurality of hall sensors onto the base substrate.

16. The method of claim 15, wherein fixating each of the plurality of hall sensors comprises underfilling each of the plurality of hall sensors subsequent to the reflow.

17. The method of claim 11, further comprising molding the at least three hall sensors of each panel prior to folding the three subpanels.

18. The method of claim 17, wherein the fixating of each of the plurality of hall sensors comprises underfilling performed during the molding of the plurality of hall sensors utilizing the mold compound.

19. The method of claim 11, further comprising attaching the second surface of each panel to a hybrid substrate.

20. The method of claim 11, wherein the molding is performed prior to excising the panel and folding of at least one of the three subpanels.