Extrusion process for manufacturing a Z-directed component for a printed circuit board

• US 8,752,280 B2
• Filed: 09/30/2011
• Issued: 06/17/2014
• Est. Priority Date: 09/30/2011
• Status: Active Grant

• Current Assignee: Lexmark International Incorporated (Ninestar Corporation)
• Original Assignee: Lexmark International Incorporated (Ninestar Corporation)
• Inventors: Hardin, Keith Bryan
• Primary Examiner(s): PHAN, THIEM D
• Application Number:
  US13/250,812
• Publication Number:
  US 20130081267A1
• Time in Patent Office: 991 Days
• Field of Search: 296/22, 298/25, 298/29, 298/46, 298/74, 298/76, 298/84, 174/255, 174260-262, 361/303, 361/306.1, 361761-763, 361/782, 361/785, 600/345, 600/347
• US Class Current: 29/622
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0248 Skew reduction or using delay lines
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/09645 Patterning on via walls; Plural lands around one hole
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: Y10T 29/49105 Switch making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49139 by inserting component lead or terminal into base aperture
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 with molding of insulated base
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing

Abstract

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material.

Claims

1. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:

extruding a substrate material through an extrusion die having a chamber defining the shape of the extruded substrate material including forming at least one channel through the substrate material with a corresponding projection in the extrusion die;

dividing the extruded substrate material into a plurality of layers of the Z-directed component according to the thickness of each layer;

applying a conductive material to a surface of at least one of the layers; and

combining a stack of the layers to form the Z-directed component.

2. The method of claim 1, further comprising extruding the substrate material in longitudinal segments and combining the longitudinal segments according to the shape of the Z-directed component, wherein the projection is positioned along an edge of the chamber and forms a partial channel in each extruded segment, and a complete channel is formed in an interior portion of the substrate material when the segments are combined.

3. The method of claim 1, wherein the projection is spaced inward from an edge of the chamber and connected to the edge of the chamber by a support member, and a gap formed in the extruded substrate material by the support member is eliminated by rejoining corresponding portions of the substrate material.

4. The method of claim 3, wherein the corresponding portions of the substrate material are rejoined after extrusion is complete.

5. The method of claim 3, wherein the corresponding portions of the substrate material are rejoined in a continuous process downstream from extrusion.

6. The method of claim 5, further comprising supporting the extruded longitudinal segments with a moving member from a downstream end of the substrate material as it advances.

7. The method of claim 1, wherein combining the stack of the layers to form the Z-directed component includes heating and compressing the stacked layers to form an aggregate part.