Protective enclosure for a thermal imaging device of an industrial monitoring system

• US 8,753,008 B2
• Filed: 06/26/2009
• Issued: 06/17/2014
• Est. Priority Date: 06/26/2009
• Status: Active Grant

• Current Assignee: Fluke Corporation (Fortive Corp.)
• Original Assignee: Fluke Corporation (Fortive Corp.)
• Inventors: Carlson, Paul S., Rekow, Mathew N.
• Primary Examiner(s): KAPLAN VERBITSKY, GAIL
• Application Number:
  US12/492,362
• Publication Number:
  US 20100329306A1
• Time in Patent Office: 1,817 Days
• Field of Search: 374120-121, 374130-131, 374/208, 374/100, 374/141, 374/2, 250/338.1, 356/43
• US Class Current: 374/208
• CPC Class Codes: G01J 2005/0077 Imaging
• CPC Class Codes: G01J 5/0205 Mechanical elements; Supports for optical elements
• CPC Class Codes: G01J 5/041 Mountings in enclosures or in a particular environment
• CPC Class Codes: G01J 5/042 High-temperature environment G01J5/0007, G01J5/0044, G01J5/0088 and G01J5/004 take precedence
• CPC Class Codes: G01J 5/048 Protective parts
• CPC Class Codes: G01J 5/064 Ambient temperature sensor; Housing temperature sensor; Constructional details thereof

Abstract

A thermal imaging device, which may be incorporated in an industrial monitoring system, is contained and protected by an enclosure that includes a window assembly. The window assembly includes a removable window and a temperature sensor, wherein the window provides a passage for infrared radiation to the imaging device, within the enclosure, and the temperature sensor is positioned, within the enclosure, for measuring a temperature of the removable window, and is adapted to communicate with circuitry of the imaging device. The window assembly may further include a removable retaining ring and a mounting plate. The mounting plate may include a bezel and an outer shoulder formed in a first side thereof, wherein the bezel receives the removable window and the outer shoulder receives the retaining ring, so that the retaining ring may hold the window against the bezel.

Claims

1. A protective enclosure for a thermal imaging device, comprising:

a mounting structure for securing the thermal imaging device in a fixed location;

a sidewall surrounding the imaging device;

a window assembly including a removable window and a temperature sensor, the window providing a passage for infrared radiation to the imaging device within the enclosure, and the temperature sensor for measuring a temperature of the window, when the window is received in the window assembly, and being adapted to communicate with circuitry of the imaging device;

the window assembly further includes a removable retaining ring and a mounting plate attached to an end of the sidewall; and

the mounting plate includes a first side facing outward, a second side facing inward, a bezel formed in the first side, and an outer shoulder also formed in the first side and surrounding the bezel, the bezel for receiving the removable window, and the outer shoulder for receiving the retaining ring, such that the retaining ring holds the window against the bezel.

2. The enclosure of claim 1, wherein the removable window comprises silicon.

3. The enclosure of claim 1, wherein the removable window comprises plastic.

4. The enclosure of claim 1, wherein the temperature sensor comprises a direct contact type temperature sensor.

5. The enclosure of claim 1, wherein the temperature sensor comprises a non-contact type temperature sensor.

6. The enclosure of claim 1, wherein the window assembly further includes a removable seal member sized to be interposed between the retaining ring and the removable window, when the window is received by the bezel and the retaining ring is received by the outer shoulder.

7. The enclosure of claim 6, wherein the mounting plate further includes an inner shoulder surrounding the bezel and being surrounded by the outer shoulder, the inner shoulder for receiving the seal member.

8. The enclosure of claim 1, wherein:

the retaining ring, when received by the outer shoulder, holds the removable window in thermal conductive contact with the mounting plate, when the window is received by the bezel;

the temperature sensor comprises a direct contact type temperature sensor; and

the temperature sensor is mounted on a circuit board, the circuit board being attached to the second side of the mounting plate so as to position the temperature sensor in thermal conductive contact with a portion of the second side of the mounting plate.

9. The enclosure of claim 1, wherein:

the retaining ring, when received by the outer shoulder, holds the removable window in thermal conductive contact with the mounting plate, when the window is received by the bezel;

the temperature sensor comprises a non-contact type temperature sensor; and

the temperature sensor is mounted on a circuit board, the circuit board being attached to the second side of the mounting plate so as to position the temperature sensor to receive infrared radiation from a portion of the second side of the mounting plate.

10. A window assembly for a protective enclosure of a thermal imaging device, the window assembly comprising:

a removable window;

a removable retaining ring;

a mounting plate including a first side, a second side, a bezel, and an outer shoulder surrounding the bezel, the bezel and the outer shoulder being formed in the first side of the mounting plate, the bezel for receiving the removable window, and the outer shoulder for receiving the retaining ring, such that the retaining ring holds the window against the bezel, the mounting plate adapted to be fixedly attached to an end of the protective enclosure, such that the first side faces outward from the enclosure and the second side faces into the enclosure; and

a temperature sensor for measuring a temperature of the window, when the window is received by the bezel of the mounting plate, the temperature sensor being adapted to communicate with circuitry of the imaging device.

11. The assembly of claim 10, wherein the removable window comprises silicon.

12. The assembly of claim 10, wherein the removable window comprises plastic.

13. The assembly of claim 10, further comprising a removable seal member sized to be interposed between the retaining ring and the removable window, when the window is received by the bezel and the retaining ring is received by the outer shoulder.

14. The assembly of claim 13, wherein the mounting plate further includes an inner shoulder surrounding the bezel and being surrounded by the outer shoulder, the inner shoulder for receiving the seal member.

15. The assembly of claim 10, wherein:

the retaining ring, when received by the outer shoulder, holds the removable window in thermal conductive contact with the mounting plate, when the window is received by the bezel;

the temperature sensor comprises a direct contact type temperature sensor; and

the temperature sensor is mounted on a circuit board, the circuit board being attached to the second side of the mounting plate so as to position the temperature sensor in thermal conductive contact with a portion of the second side of the mounting plate.

16. The assembly of claim 10, wherein:

the retaining ring, when received by the outer shoulder, holds the removable window in thermal conductive contact with the mounting plate, when the window is received by the bezel;

the temperature sensor comprises a non-contact type temperature sensor; and

the temperature sensor is mounted on a circuit board, the circuit board being attached to the second side of the mounting plate so as to position the temperature sensor to receive infrared radiation from a portion of the second side of the mounting plate.

17. An industrial monitoring system, comprising:

a thermal imaging device;

an enclosure for containing and protecting the thermal imaging device, the enclosure comprising;

a mounting structure for securing the enclosure and the thermal imaging device in a fixed location;

a sidewall surrounding the imaging device;

a window assembly including a removable window, a temperature sensor, a removable retaining ring and a mounting plate attached to an end of the sidewall;

the window providing a passage for infrared radiation to the imaging device within the enclosure, and the temperature sensor for measuring a temperature of the window, when the window is received in the window assembly, the temperature sensor being adapted to communicate with the circuitry of the imaging device; and

the mounting plate including a first side facing outward, a second side facing inward, a bezel formed in the first side, and an outer shoulder also formed in the first side and surrounding the bezel, the bezel for receiving the removable window, and the outer shoulder for receiving the retaining ring, such that the retaining ring holds the window against the bezel.

18. The system of claim 17, wherein the window assembly of the enclosure further includes a removable seal member sized to be interposed between the retaining ring and the removable window, when the window is received by the bezel and the retaining ring is received by the outer shoulder.

19. The system of claim 18, wherein the mounting plate further includes an inner shoulder surrounding the bezel and being surrounded by the outer shoulder, the inner shoulder for receiving the seal member of the enclosure.

20. The system of claim 17, wherein:

the retaining ring, when received by the outer shoulder, holds the removable window in thermal conductive contact with the mounting plate, when the window is received by the bezel;

the temperature sensor comprises a direct contact type temperature sensor; and

the temperature sensor is mounted on a circuit board, the circuit board being attached to the second side of the mounting plate so as to position the temperature sensor in thermal conductive contact with a portion of the second side of the mounting plate.

21. The system of claim 17, wherein:

the retaining ring of the enclosure, when received by the outer shoulder, holds the removable window of the enclosure in thermal conductive contact with the mounting plate of the enclosure, when the window is received by the bezel;

the temperature sensor comprises a non-contact type temperature sensor; and

the temperature sensor is mounted on a circuit board, the circuit board being attached to the second side of the mounting plate so as to position the temperature sensor to receive infrared radiation from a portion of the second side of the mounting plate.