MEMS device with simplified electrical conducting paths

• US 8,754,529 B2
• Filed: 02/21/2012
• Issued: 06/17/2014
• Est. Priority Date: 03/28/2011
• Status: Active Grant

• Current Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Original Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Inventors: Wu, Hua-Shu, Yeh, Yu-Te, Chien, Yu-Hao, Chung, Shih-Yung, Tseng, Li-Tien
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US13/401,075
• Publication Number:
  US 20120248615A1
• Time in Patent Office: 847 Days
• Field of Search: 257/415, 257/417, 257/E29.324, 257/E21.499, 257/773, 257/774, 257/668, 257/741, 257/771, 257/E23.011, 257/770, 438/107
• US Class Current: 257/770
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A MEMS device comprises a substrate for manufacturing a moving MEMS component is divided into two electrically isolated conducting regions to allow the moving MEMS component and a circuit disposed on its surface to connect electrically with another substrate below respectively through their corresponding conducting regions, thereby the electrical conducting paths and manufacturing process can be simplified.

Claims

1. A MEMS device comprising:

a first substrate comprising at least a first circuit disposed on a surface of the first substrate;

a second substrate having a first surface and a second surface, the second substrate comprising;

a MEMS component divided from the second substrate, disposed on the surface of the first substrate with the first surface facing towards the first substrate, and electrically connected with the first circuit;

a conducting part divided from the second substrate, electrically isolated from the MEMS component, and electrically connected with the first circuit; and

a second circuit disposed on the second surface of the MEMS component, electrically isolated from the MEMS component, and electrically connected with the first circuit via the conducting part;

a third substrate having a recessed region and a plurality of standoff structures, disposed over the second substrate, and connecting to the first substrate with the standoff structures such that the second substrate is enclosed in the recessed region.

2. The MEMS device according to claim 1, wherein the MEMS component comprises a conducting via, wherein the conducting via penetrates through the first surface and the second surface of the MEMS component, and is electrically connected with the first circuit and is electrically connected with the MEMS component through an ohmic contact.

3. The MEMS device according to claim 2, wherein the MEMS component further comprises a conductive layer, wherein the conductive layer is electrically connected with the conducting via, and forms the ohmic contact with the second surface the MEMS component.

4. The MEMS device according to claim 2, wherein the ohmic contact region comprises at least one of silicon, aluminum-copper alloy, titanium nitride and tungsten.

5. The MEMS device according to claim 1, wherein the conducting part comprises a conducting via penetrating the first surface and the second surface of the conducting part, and connecting electrically with the first circuit and the second circuit.

6. The MEMS device according to claim 1, wherein the second circuit forms an ohmic contact with the conducting part at the second surface, and the ohmic contact region comprises at least one of silicon, aluminum-copper alloy, titanium nitride and tungsten.

7. The MEMS device according to claim 1, wherein the first substrate comprises a CMOS substrate.

8. The MEMS device according to claim 1, wherein the second substrate comprises single crystal silicon.

9. The MEMS device according to claim 1, wherein the thickness of the second substrate varies as a function of position along a direction orthogonal to the thickness of the second substrate.

10. The MEMS device according to claim 1, wherein the connection regions of the MEMS component and the first circuit, and the conducting part and the first circuit comprise an alloy comprising at least one of aluminum, copper, germanium, indium, gold and silicon.

11. The MEMS device according to claim 1, wherein the connection regions of the third substrate and the first substrate comprise an alloy comprising at least one of aluminum, copper, germanium, indium, gold and silicon.

12. The MEMS device according to claim 1, wherein the third substrate is conductive and comprises at least one of doped silicon, ceramic with conductive plating, glass with a tin oxide (ITO) coating, and tantalum oxide.