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Method of manufacturing a lighting assembly with thermal overmolding

  • US 8,756,801 B2
  • Filed: 11/23/2011
  • Issued: 06/24/2014
  • Est. Priority Date: 11/29/2005
  • Status: Active Grant
First Claim
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1. A method of manufacturing a lighting assembly, the method comprising:

  • locating one or more light emitting diodes (LEDs) on a printed circuit board;

    electrically and mechanically connecting the printed circuit board to a plurality of flexible electrical conductors;

    disposing one or more light-transmissive covers over said one or more LEDs;

    placing the circuit board with attached LEDs and flexible electrical conductors in a mold, said mold including one or more isolation regions associated with the one or more LEDs and one or more light-transmissive covers; and

    insert molding an overmolding material over at least portions of the printed circuit board proximate the LEDs;

    wherein the one or more isolation regions prevent an at least one aperture and a portion of the light-transmissive cover over the LEDs from being covered with overmolding material.

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