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Low profile image sensor package

  • US 8,759,930 B2
  • Filed: 09/10/2012
  • Issued: 06/24/2014
  • Est. Priority Date: 09/10/2012
  • Status: Active Grant
First Claim
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1. An image sensor package, comprising:

  • a printed circuit board including;

    a first substrate with opposing first and second surfaces,an aperture extending through the first substrate between the first and second surfaces,one or more circuit layers,a plurality of first contact pads electrically coupled to the one or more circuit layers;

    a sensor chip mounted to the printed circuit board and disposed at least partially in the aperture, wherein the sensor chip includes;

    a second substrate with opposing first and second surfaces,a plurality of photo detectors formed on or in the second substrate, anda plurality of second contact pads formed at the first surface of the second substrate which are electrically coupled to the photo detectors;

    electrical connectors each electrically connecting one of the first contact pads and one of the second contact pads; and

    a lens module mounted to the printed circuit board, wherein the lens module includes one or more lenses disposed for focusing light onto the photo detectors.

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