Low profile image sensor package

• US 8,759,930 B2
• Filed: 09/10/2012
• Issued: 06/24/2014
• Est. Priority Date: 09/10/2012
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage
• Primary Examiner(s): Jahan, Bilkis
• Application Number:
  US13/609,002
• Publication Number:
  US 20140070349A1
• Time in Patent Office: 652 Days
• Field of Search: 257/432, 257/59, 257/72
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An image sensor package, and method of making same, that includes a printed circuit board having a first substrate with an aperture extending therethrough, one or more circuit layers, and a plurality of first contact pads electrically coupled to the one or more circuit layers. A sensor chip mounted to the printed circuit board and disposed at least partially in the aperture. The sensor chip includes a second substrate, a plurality of photo detectors formed on or in the second substrate, and a plurality of second contact pads formed at the surface of the second substrate which are electrically coupled to the photo detectors. Electrical connectors each electrically connect one of the first contact pads and one of the second contact pads. A lens module is mounted to the printed circuit board and has one or more lenses disposed for focusing light onto the photo detectors.

Claims

1. An image sensor package, comprising:

a printed circuit board including;

a first substrate with opposing first and second surfaces,

an aperture extending through the first substrate between the first and second surfaces,

one or more circuit layers,

a plurality of first contact pads electrically coupled to the one or more circuit layers;

a sensor chip mounted to the printed circuit board and disposed at least partially in the aperture, wherein the sensor chip includes;

a second substrate with opposing first and second surfaces,

a plurality of photo detectors formed on or in the second substrate, and

a plurality of second contact pads formed at the first surface of the second substrate which are electrically coupled to the photo detectors;

electrical connectors each electrically connecting one of the first contact pads and one of the second contact pads; and

a lens module mounted to the printed circuit board, wherein the lens module includes one or more lenses disposed for focusing light onto the photo detectors.

2. The image sensor package of claim 1, wherein the sensor chip further comprises:

a trench formed into the first surface of the second substrate;

a plurality of conductive traces each extending from one of the second contact pads and into the trench;

wherein the electrical connectors are Ball Grid Array (BGA) or Land Grid Array electrical connectors that each electrically connect one of the first contact pads to one of the plurality of conductive traces.

3. The image sensor package of claim 2, further comprising:

an optically transparent substrate mounted to the printed circuit board, wherein the optically transparent substrate is disposed between the printed circuit board and the lens module and is disposed over the aperture.

4. The image sensor package of claim 1, wherein the printed circuit board includes a laterally extending shoulder in the aperture.

5. The image sensor package of claim 4, wherein the sensor chip further comprises:

a third substrate attached to the first surface of the second substrate;

a plurality of openings each extending through the third substrate and exposing one of the second contact pads;

a plurality of conductive traces each extending from one of the second contact pads and through one of the plurality of openings;

wherein each of the electrical connectors is a Ball Grid Array (BGA) or Land Grid Array electrical connector connected between one of the plurality of conductive traces and one of the first contact pads.

6. The image sensor package of claim 4, wherein:

the plurality of first contact pads are disposed at the shoulder of the first substrate;

the electrical connectors are Ball Grid Array (BGA) or Land Grid Array electrical connectors;

the sensor chip is mounted to the printed circuit board via the electrical connectors.

7. The image sensor package of claim 6, further comprising:

an optically transparent substrate mounted to and spaced from the sensor chip second surface.

8. The image sensor package of claim 4, wherein the lens module is mounted to the second surface of the first substrate, and disposed over the opening.

9. The image sensor package of claim 4, wherein the plurality of first contact pads are disposed at the first surface of the first substrate.

10. The image sensor package of claim 4, wherein the sensor chip further comprises:

a third substrate attached to the first surface of the second substrate;

a plurality of openings each extending through the third substrate and exposing one of the second contact pads;

a plurality of conductive traces each extending from one of the second contact pads and through one of the plurality of openings;

wherein each of the electrical connectors is a wire connected between one of the plurality of conductive traces and one of the first contact pads.

11. The image sensor package of claim 4, wherein the sensor chip is mounted to the shoulder via adhesive, and wherein the plurality of photo detectors are oriented to receive light passing through the opening.

12. The image sensor package of claim 11, further comprising:

an optically transparent substrate mounted to and spaced from the second substrate second surface, wherein the adhesive is disposed directly between the optically transparent substrate and the shoulder.

13. The image sensor package of claim 11, wherein the adhesive is disposed directly between the second substrate second surface and the shoulder.