Low inductance capacitor assembly

• US 8,760,847 B2
• Filed: 11/30/2010
• Issued: 06/24/2014
• Est. Priority Date: 11/30/2010
• Status: Active Grant

• Current Assignee: Pratt & Whitney Canada Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Pratt & Whitney Canada Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Dooley, Kevin Allan, Bell, Joshua
• Primary Examiner(s): Thomas, Eric
• Assistant Examiner(s): Ferguson, Dion
• Application Number:
  US12/956,111
• Publication Number:
  US 20120134069A1
• Time in Patent Office: 1,302 Days
• Field of Search: None
• US Class Current: 361/328
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/236 leading through the housing, i.e. lead-through
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/38 Multiple capacitors, i.e. structural combinations of fixed capacitors
• CPC Class Codes: Y10T 29/43 Electric condenser making

Abstract

A low-inductance capacitor assembly (12) is provided. The capacitor assembly (12) includes a positive terminal plate (16), a negative terminal plate (18) and an array (20) of capacitors (22) disposed between and electrically coupled to the positive terminal plate (16) and the negative terminal plate (18). A passage (30) extends through the positive terminal plate (16), the negative terminal plate (18) and through a void (35) formed within the array (20) of capacitors (22). The passage (30) may allow routing of a conductor (14) through the capacitor assembly (12).

Claims

1. A capacitor assembly comprising:

a positive terminal plate and a negative terminal plate;

an array of capacitors, the capacitors being disposed between and electrically coupled to the positive terminal plate and the negative terminal plate in parallel; and

at least one passage extending through the positive terminal plate, the negative terminal plate and through a void formed within the array of capacitors, the void including a location where at least one capacitor is omitted from the array of capacitors.

2. The capacitor assembly as defined in claim 1, wherein the array of capacitors includes a two-dimensional array of capacitors.

3. The capacitor assembly as defined in claim 2, wherein the capacitors include chip capacitors.

4. The capacitor assembly as defined in claim 3, comprising a non-conductive matrix through which the capacitors are disposed.

5. The capacitor assembly as defined in claim 1, comprising an electrically-conductive epoxy electrically coupling at least one of the capacitors to at least one of the positive terminal plate and the negative terminal plate.

6. The capacitor assembly as defined in claim 1, comprising at least one mechanical connector secured between the positive terminal plate and the negative terminal plate.

7. The capacitor assembly as defined in claim 1, comprising a non-conductive assembly matrix through which the capacitors are disposed.

8. The capacitor assembly as defined in claim 7, comprising an electrically-conductive epoxy electrically coupling the capacitors to the positive terminal plate and the negative terminal plate.

9. The capacitor assembly as defined in claim 8, wherein the capacitors include chip capacitors.

10. The capacitor assembly as defined in claim 9, wherein the void is surrounded by capacitors within the array of capacitors.

11. A capacitor installation comprising:

a first terminal plate having a first opening and a second terminal plate having a second opening;

an array of capacitors, the capacitors being disposed between and electrically coupled to the first terminal plate and the second terminal plate in parallel, the array of capacitors forming a void cooperating with the first opening and the second opening to form a passage, the void including a location where at least one capacitor is omitted from the array of capacitors; and

a conductor or other system component extending through the passage.

12. The capacitor installation as defined in claim 11, wherein the void is surrounded by capacitors within the array of capacitors.

13. The capacitor installation as defined in claim 11, comprising a non-conductive assembly matrix through which the capacitors are disposed.

14. The capacitor installation as defined in claim 11, wherein a connector extends through the passage.

15. A capacitor assembly comprising:

a positive terminal plate and a negative terminal plate;

a non-conductive matrix disposed between the positive plate and the negative plate, the matrix comprising a plurality of through sockets;

a plurality of capacitors inserted in respective sockets within the matrix, the capacitors being electrically coupled to the positive terminal plate and the negative terminal plate in parallel; and

at least one mechanical connector secured between the positive terminal plate and the negative terminal plate;

the mechanical connector being inserted in one of the sockets of the matrix.

16. The capacitor assembly as defined in claim 15, comprising an electrically-conductive epoxy electrically coupling at least one of the capacitors to at least one of the positive terminal plate and the negative terminal plate.

17. The capacitor assembly as defined in claim 15, wherein the capacitors include chip capacitors.

18. The capacitor assembly as defined in claim 17, wherein the sockets are arranged in a two-dimensional array.

19. A capacitor assembly comprising:

a positive terminal plate and a negative terminal plate;

an array of capacitors disposed between and electrically coupled to the positive terminal plate and the negative terminal plate; and

at least one passage extending through the positive terminal plate, the negative terminal plate and through a void formed within the array of capacitors, the void including a location where at least one capacitor is omitted from the array of capacitors.

20. A capacitor installation comprising:

a first terminal plate having a first opening and a second terminal plate having a second opening;

an array of capacitors disposed between and electrically coupled to the first terminal plate and the second terminal plate, the array of capacitors forming a void cooperating with the first opening and the second opening to form a passage, the void including a location where at least one capacitor is omitted from the array of capacitors; and

a conductor or other system component extending through the passage.

21. A capacitor assembly comprising:

a positive terminal plate and a negative terminal plate;

a non-conductive matrix disposed between the positive plate and the negative plate, the matrix comprising a plurality of through sockets;

a plurality of capacitors inserted in respective sockets within the matrix, the capacitors being electrically coupled to the positive terminal plate and the negative terminal plate; and

at least one mechanical connector secured between the positive terminal plate and the negative terminal plate, the mechanical connector being inserted in one of the sockets of the matrix.