Modular high-power drive stack cooled with vaporizable dielectric fluid

• US 8,760,855 B2
• Filed: 11/05/2012
• Issued: 06/24/2014
• Est. Priority Date: 05/16/2008
• Status: Expired due to Fees

• Current Assignee: Parker-Hannifin Corporation
• Original Assignee: Parker-Hannifin Corporation
• Inventors: Howes, Jeremy Charles, Levett, David
• Primary Examiner(s): SMITH, COURTNEY L
• Application Number:
  US13/668,875
• Publication Number:
  US 20130063897A1
• Time in Patent Office: 596 Days
• Field of Search: 361676-677, 361688-689, 361696-720
• US Class Current: 361/677
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 13/005 Electrical coupling combined with fluidic coupling
• CPC Class Codes: H05K 7/20936 Liquid coolant with phase change

Abstract

A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.

Claims

1. A high power drive stack system comprising:

a common support structure comprising a system power source, a dielectric fluid cooling system, and a plurality of receivers;

at least one module comprising a power component and a dielectric fluid cooling circuit associated with the power component, the at least one module removably insertable into one of the plurality of receivers of the common support structure and connected thereto by a least two connectors;

each connector of the at least two connectors comprising a plug and mating socket, each plug and each socket are formed at least in part as a hollow tube, at least a portion of the tube being electrically conductive along its length, each tube forming an electrical connection and a fluidic passageway between the at least one module and the common support structure.

2. The system of claim 1 wherein the dielectric fluid cooling system and the dielectric fluid cooling circuit utilize a vaporizable dielectric refrigerant.

3. The system of claim 1 further including a plurality of modules.

4. The system of claim 3, wherein the plurality of modules are positioned in and secured to the common support structure.

5. The system of claim 4, wherein the common support structure is a rack or cabinet.

6. The system of claim 2, wherein the dielectric fluid cooling system comprises a plurality of fluid conduits, a pump, a condenser, and an evaporator, the evaporator positioned on the at least one module.

7. The system of claim 2, wherein each connector is a dry-break connector.

8. The system of claim 7, wherein each connector is a non-latching connector.

9. The system of claim 1, wherein the at least one module further comprises a cold plate operating at the potential of a power component bonded directly to the cold plate.

10. The system of claim 1, wherein at least portions of the module dielectric fluid cooling circuit associated with the power component are used as current carrying bus bars.

11. The system of claim 1, wherein the power component of the at least one module is a silicon disk or die.

12. The system of claim 11, wherein the at least one module further comprises a heat sink on both sides of the silicon disk or die, wherein the module dielectric fluid cooling circuit passes through both the heat sinks, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.

13. The system of claim 11, wherein the at least one module further comprising a heat sink on both sides of the silicon disk or die, wherein the module dielectric fluid cooling circuit passes through both the heat sinks, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.

14. The system of claim 1, wherein dielectric fluid of the module dielectric fluid cooling circuit is in direct contact with at least a portion of the silicon disk or die of the module, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.

15. The system of claim 2, wherein at least one module includes at least one of an IGBT or diode.

16. The system of claim 15, wherein the at least one IGBT or diode is mounted on a heat sink.

17. The system of claim 16, wherein the dielectric fluid flows through the heat sink.