Deposit/etch for tapered oxide

• US 8,765,609 B2
• Filed: 07/25/2012
• Issued: 07/01/2014
• Est. Priority Date: 07/25/2012
• Status: Expired due to Fees

• Current Assignee: Power Integrations Incorporated
• Original Assignee: Power Integrations Incorporated
• Inventors: Parthasarathy, Vijay, Banerjee, Sujit, Grabowski, Wayne B.
• Primary Examiner(s): Smith, Zandra
• Assistant Examiner(s): BARZYKIN, VICTOR V
• Application Number:
  US13/558,218
• Publication Number:
  US 20140030868A1
• Time in Patent Office: 706 Days
• Field of Search: 438/430, 438/589, 438/206, 438/216, 438/173, 438/133, 438/135, 438/738, 438638-640, 438/689, 438270-272, 438700-703, 438/92, 438/167, 438/570, 438/259, 438/212, 438/268, 257/330, 257/333, 257/565, 257/471, 257/475, 257/E21.359, 257/E29.133, 257/E29.338, 257/E29.04, 257/E29.262, 257/328, 257/341, 257/342
• US Class Current: 438/701
• CPC Class Codes: H01L 21/76224 using trench refilling with dielectric materials trench filling with polycristalline silicon H01L21/763; together with vertical isolation, e.g. trench refilling in a SOI substrate H01L21/76264
• CPC Class Codes: H01L 29/407 Recessed field plates, e.g. trench field plates, buried field plates
• CPC Class Codes: H01L 29/41 characterised by their shape, relative sizes or dispositions

Abstract

A process for fabricating a tapered field plate dielectric for high-voltage semiconductor devices is disclosed. The process may include depositing a thin layer of oxide, depositing a polysilicon hard mask, depositing a resist layer and etching a trench area, performing deep silicon trench etch, and stripping the resist layer. The process may further include repeated steps of depositing a layer of oxide and anisotropic etching of the oxide to form a tapered wall within the trench. The process may further include depositing poly and performing further processing to form the semiconductor device.

Claims

1. A method of forming a tapered field plate dielectric region in a semiconductor wafer, the method comprising:

etching a trench in the semiconductor wafer, wherein the trench has a sidewall;

depositing a first thickness of a first insulating layer on the semiconductor wafer, including the sidewall;

etching a first amount of the first insulating layer, wherein a first upper portion of the first insulating layer adjacent to the top of the trench is removed to expose a first upper surface of the first insulating layer;

depositing a second thickness of a second insulating layer on the semiconductor wafer, wherein the second insulating layer overlaps a portion of the first insulating layer, and wherein the second insulating layer overlaps the first upper surface; and

etching a second amount of the second insulating layer, wherein a second upper portion of the second insulating layer on the sidewall of the trench is removed.

2. The method of claim 1, wherein etching the second amount of the second insulating layer exposes at least part of the first insulating layer adjacent the second upper portion.

3. The method of claim 1, further comprising:

depositing a third thickness of a third insulating layer on the semiconductor wafer; and

etching a third amount of the third insulating layer, wherein a third upper portion of the third insulating layer on the sidewall of the trench is removed.

4. The method of claim 3, wherein etching the third amount of the third insulating layer exposes at least part of the first insulating layer adjacent the third upper portion and at least part of the second insulating layer adjacent the third upper portion.

5. The method of claim 1, wherein the first and second thicknesses are approximately the same.

6. The method of claim 5, wherein the first and second insulating layers are the same materials.

7. The method of claim 1, wherein the first thickness is substantially independent of the slope of the surface that the first insulating layer is being deposited on.

8. The method of claim 1 further comprising:

prior to etching the trench, patterning a hardmask that defines the location of the trench, wherein patterning the hardmask includes depositing a hardmask material.

9. The method of claim 8, wherein the hardmask is made of polysilicon.

10. The method of claim 9 further comprising:

prior to depositing the hardmask, depositing a protection layer on the surface of the semiconductor wafer.

11. The method of claim 10, wherein the protection layer is an oxide.

12. The method of claim 1 further comprising:

depositing a conductive material on the first insulating layer and the second insulating layer in the trench, wherein the conductive material is separated from direct contact with the sidewall of the trench by the first insulating layer and the second insulating layer.

13. The method of claim 1, wherein etching the first insulating layer and etching the second insulating layer are done with an anisotropic etch.