Light emitting diode device
First Claim
1. A light emitting diode device comprising:
- an epitaxial substrate;
at least one passivation structure disposed on the epitaxial substrate and having an outer surface, wherein the passivation structure comprises a protrusion portion and a passivation layer, the protrusion portion is disposed on the epitaxial substrate, the passivation layer is disposed on at least one side of the protrusion portion and in contact with the protrusion portion, a material of the protrusion portion is sapphire, and a material of the passivation layer is silicon dioxide or aluminium nitride;
at least one void located on the passivation structure and at least covering 50% of the outer surface of the passivation structure;
a semiconductor layer disposed on the epitaxial substrate and encapsulating the passivation structure and the void;
a first type doping semiconductor layer disposed on the semiconductor layer;
a light-emitting layer disposed on the first type doping semiconductor layer; and
a second type doping semiconductor layer disposed on the light-emitting layer.
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Accused Products
Abstract
A light emitting diode device includes an epitaxial substrate, at least one passivation structure, at least one void, a semiconductor layer, a first type doping semiconductor layer, a light-emitting layer and a second type doping semiconductor layer. The passivation structure is disposed on the epitaxial substrate and has an outer surface. The void is located at the passivation structure and at least covering 50% of the outer surface of the passivation structure. The semiconductor layer is disposed on the epitaxial substrate and encapsulating the passivation structure and the void. The first type doping semiconductor layer is disposed on the semiconductor layer. The light-emitting layer is disposed on the first type doping semiconductor layer. The second type doping semiconductor layer is disposed on the light emitting layer.
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Citations
13 Claims
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1. A light emitting diode device comprising:
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an epitaxial substrate; at least one passivation structure disposed on the epitaxial substrate and having an outer surface, wherein the passivation structure comprises a protrusion portion and a passivation layer, the protrusion portion is disposed on the epitaxial substrate, the passivation layer is disposed on at least one side of the protrusion portion and in contact with the protrusion portion, a material of the protrusion portion is sapphire, and a material of the passivation layer is silicon dioxide or aluminium nitride; at least one void located on the passivation structure and at least covering 50% of the outer surface of the passivation structure; a semiconductor layer disposed on the epitaxial substrate and encapsulating the passivation structure and the void; a first type doping semiconductor layer disposed on the semiconductor layer; a light-emitting layer disposed on the first type doping semiconductor layer; and a second type doping semiconductor layer disposed on the light-emitting layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification