Method of manufacturing a semiconductor component and structure
First Claim
Patent Images
1. A semiconductor component, comprising:
- a first electrically conductive structure having first and second ends and a body region between the first and second ends;
a second electrically conductive structure having first and second ends and a body region between the first and second ends, the second electrically conductive structure vertically spaced apart from the first electrically conductive structure, a first portion of the body region of the second electrically conductive structure over a first portion of the body region of the first electrically conductive structure, and the first end of the first electrically conductive structure laterally and vertically spaced apart from the first end of the second electrically conductive structure;
a first bond wire having first and second ends, wherein the first end of the first bond wire is electrically coupled to the first end of the first electrically conductive structure; and
a second bond wire having first and second ends, wherein the first end of the second bond wire is electrically coupled to the first end of the second electrically conductive structure, and wherein the first electrically conductive structure and the first bond wire are configured to form a portion of a first coil that generates flux of a first polarity and the second electrically conductive structure and the second bond wire are configured to form a first portion of a second coil that generates flux of a second polarity, the second polarity opposite to the first polarity.
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Abstract
A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
15 Citations
22 Claims
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1. A semiconductor component, comprising:
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a first electrically conductive structure having first and second ends and a body region between the first and second ends; a second electrically conductive structure having first and second ends and a body region between the first and second ends, the second electrically conductive structure vertically spaced apart from the first electrically conductive structure, a first portion of the body region of the second electrically conductive structure over a first portion of the body region of the first electrically conductive structure, and the first end of the first electrically conductive structure laterally and vertically spaced apart from the first end of the second electrically conductive structure; a first bond wire having first and second ends, wherein the first end of the first bond wire is electrically coupled to the first end of the first electrically conductive structure; and a second bond wire having first and second ends, wherein the first end of the second bond wire is electrically coupled to the first end of the second electrically conductive structure, and wherein the first electrically conductive structure and the first bond wire are configured to form a portion of a first coil that generates flux of a first polarity and the second electrically conductive structure and the second bond wire are configured to form a first portion of a second coil that generates flux of a second polarity, the second polarity opposite to the first polarity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A semiconductor component, comprising:
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a first set of electrically conductive strips, wherein each electrically conductive strip of the first set of electrically conductive strips has a body region and first and second ends, and wherein the first set of electrically conductive strips is in a first plane; a second set of electrically conductive strips, wherein each electrically conductive strip of the second set of electrically conductive strips has a body region and first and second ends, and wherein the second set of electrically conductive strips is in a second plane, the second plane different from the first plane, and wherein a first end of a first electrically conductive strip of the second set of electrically conductive strips is laterally positioned between the first ends of first and second electrically conductive strips of the first set of electrically conductive strips; a first bond wire coupled between the first end of the second electrically conductive strip of the first set of electrically conductive strips and the second end of the first electrically conductive strip of the first set of electrically conductive strips, wherein the first and second electrically conductive strips of the first set of electrically conductive strips and the first bond wire are configured to form a portion of a first coil that generates flux of a first polarity and the second set of electrically conductive strips are configured to form a first portion of a second coil that generates flux of a second polarity that is opposite to the first polarity. - View Dependent Claims (14, 15, 16, 17)
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18. A semiconductor component, comprising:
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a semiconductor material having a major surface; a first dielectric structure formed over the semiconductor material; a first metallization system formed over the first dielectric structure, the first metallization system comprising; a first electrically conductive strip having a body region and first and second ends; and a second electrically conductive strip having a body region and first and second ends; a second dielectric structure formed over the first metallization system; and a second metallization system formed over the second dielectric structure, the second metallization system comprising; a third electrically conductive strip having a body region and first and second ends; a fourth electrically conductive strip having a body region and first and second ends; first and second contacts in contact with the first and second ends of the first electrically conductive strip, respectively; third and fourth contacts in contact with the first and second ends of the second electrically conductive strip, respectively; fifth and sixth contacts in contact with the first and second ends of the third electrically conductive strip, respectively; seventh and eighth contacts in contact with the first and second ends of the fourth electrically conductive strip, respectively; a first bond wire coupled to the first contact; a second bond wire coupled between the fifth and eighth contacts; a third bond wire coupled between the second and third contacts; and a fourth bond wire coupled to the seventh contact, wherein the first metallization system and the first and third bond wires are configured to form a portion of a first coil that generates flux of a first polarity and the second metallization system and the second and fourth bond wires are configured to form a portion of a second coil that generates flux of a second polarity, the second polarity opposite the first polarity. - View Dependent Claims (19, 20, 21, 22)
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Specification