Stacked substrate structure

• US 8,767,409 B2
• Filed: 05/12/2012
• Issued: 07/01/2014
• Est. Priority Date: 02/08/2012
• Status: Active Grant

• Current Assignee: Universal Global Scientific Industrial Company Limited (ASE Technology Holding Co., Ltd.), Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Global Scientific Industrial Company Limited (ASE Technology Holding Co., Ltd.), Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Cheng, Tsung-Jung
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US13/470,301
• Publication Number:
  US 20130201648A1
• Time in Patent Office: 780 Days
• Field of Search: 361770-790, 257685-686
• US Class Current: 361/790
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder.

Claims

1. A stacked substrate structure, comprising:

a substrate unit (20) including a first substrate (21) and a second substrate (22), each of the first and the second substrate having at least an electrical component (24) placed thereon;

a frame (25) arranged between and separating the first and the second substrates, comprising;

a conductive unit (27) including a plurality of opposingly arranged first conductors (271) and second conductors (272),

wherein the first substrate and the frame are connected through solders (29) on the first conductors,

wherein the second substrate and the frame are connected through the solders (29) on the second conductors,

wherein the first and the second conductors are in electrical connection, and

a blocker unit (28) including at least two first blockers (281) and at least two opposingly arranged second blockers (282);

the first blockers being a continuously enclosing conductive structure surroundingly and substantially coplanarly arranged around the first conductors, and

the second blockers being a continuously enclosing conductive structure surroundingly arranged around the second conductors, respectively,

wherein the first substrate and the first frame are connected in a sealed manner through the first blockers combined by solder,

wherein the second substrate and the frame are connected in a sealed manner through the second blockers combined by solder.

2. The stacked substrate structure according to claim 1, wherein the first and the second substrates are printed circuit boards, and the first and the second conductors are welding pads, and wherein the first and the second blockers are one-pieced welding pads surrounding the frames and the substrates.

3. The stacked substrate structure according to claim 1, wherein the frame is a hollow structure which defines a receiving space therein for receiving the electrical components of the first and the second substrates, and wherein the frame provides electrical connection and signal transmission.

4. The stacked substrate structure according to claim 1, wherein the plurality of first and second conductors provide connection through the solders formed thereon after the reflow process, and wherein the first and the second blockers provide connection through the solders formed thereon after the reflow process.

5. The stacked substrate structure according to claim 1, further comprising:

a package layer formed on the first substrate; and

an electromagnetic shielding unit formed on the outer surface of the package layer, and the side surfaces of the stacked substrate structure.