Microphone module with sound pipe

• US 8,767,982 B2
• Filed: 10/26/2012
• Issued: 07/01/2014
• Est. Priority Date: 11/17/2011
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Harney, Kieran P., Sengupta, Dipak, Moss, Brian, Guery, Alain V.
• Primary Examiner(s): Islam, Mohammad
• Assistant Examiner(s): DABNEY, PHYLESHA LARVINIA
• Application Number:
  US13/661,401
• Publication Number:
  US 20130129136A1
• Time in Patent Office: 613 Days
• Field of Search: 381/111, 381174-178, 381/355, 381/361, 381/369, 257/416, 257/704, 295/94
• US Class Current: 381/174
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/08 Mouthpieces; Microphones; Attachments therefor
• CPC Class Codes: H04R 1/342 for microphones
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Abstract

A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Claims

1. A microphone module comprising:

a substrate having a first side, and a second side opposite the first side, the substrate having an aperture extending from the first side to the second side to allow sound waves to pass through the substrate;

a lid mounted to the first side, the first side and lid defining a first interior volume;

a microphone mounted to the first side and within the first interior volume;

a housing coupled to the second side and covering the aperture, the housing and second side forming a second interior volume, the housing including an acoustic port configured to allow sound to enter the second interior volume;

a pipe extending from the acoustic port in the housing, the pipe having an open end to receive sound waves and direct them toward the acoustic port in the housing; and

at least one exterior interface pad on the second side and outside of the second interior volume, the at least one exterior interface pad electrically coupled to the microphone.

2. The microphone module as defined by claim 1 wherein the housing has a top wall and at least one sidewall, the acoustic port being disposed through the sidewall of the housing, the pipe extending from the at least one sidewall of the housing.

3. The microphone module as defined by claim 1 wherein the microphone comprises a MEMS microphone.

4. The microphone module as defined by claim 3 further comprising a circuit chip coupled with the first side of the substrate.

5. The microphone module as defined by claim 4 wherein the lid comprises conductive material, the lid being electrically connected with the substrate.

6. The microphone module as defined by claim 1 wherein the housing comprises a conductive material.

7. The microphone module as defined by claim 1 wherein the at least one exterior interface pad is surface mountable.

8. The microphone module as defined by claim 1 wherein the substrate comprises a laminate.

9. The microphone module as defined by claim 1 wherein the microphone covers the aperture in the substrate.

10. The microphone module as defined by claim 1 wherein the housing covers no more than a portion of the second side of the substrate.

11. The microphone as defined by claim 1 further comprising:

an interior interface pad within the first interior volume;

a circuit chip within the interior volume; and

first and second wire bonds within the interior volume,

the first wire bond electrically connecting the microphone to the circuit chip,

the second wire bond electrically connecting the circuit chip to the interior interface pad,

the microphone electrically connecting with the exterior interface pad on the second side through the first wire bond, circuit chip, second wire bond, and interior interface pad.

12. The microphone module as defined by claim 1 wherein the substrate has a metalized portion, the lid being formed from metal and being electrically connected to the metalized portion of the substrate to protect against electromagnetic interference.

13. A microphone module comprising:

a substrate having a first side, and a second side opposite the first side, the substrate having an aperture extending from the first side to the second side to allow sound waves to pass through the substrate, the substrate having a metalized portion;

a lid mounted to the first side, the first side and lid defining a first interior volume, the lid being formed from a conductive material, the lid being electrically connected to the metalized portion of the substrate to protect against electromagnetic interference;

a microphone mounted to the first side and within the first interior volume, the microphone being a MEMS microphone;

a circuit chip coupled with the first side of the substrate and being electrically connected with the microphone, the circuit chip being mounted within the first interior volume;

a housing coupled to the second side and covering the aperture, the housing and second side forming a second interior volume, the housing including an acoustic port configured to allow sound to enter the second interior volume, the housing covering no more than a portion of the second side of the substrate;

a pipe extending from the acoustic port in the housing, the pipe having an open end to receive sound waves and direct them toward the acoustic port in the housing; and

at least one exterior interface pad on the second side and outside of the second interior volume, the at least one exterior interface pad electrically coupled to the microphone, the at least one exterior interface pad being solderable.

14. The microphone module as defined by claim 13 wherein the housing has a top and at least one sidewall, the acoustic port being disposed through the sidewall of the housing, the pipe extending from the at least one sidewall of the housing.

15. The microphone module as defined by claim 13 wherein the housing comprises a conductive material.

16. The microphone module as defined by claim 13 wherein the microphone covers the aperture in the substrate.

17. The microphone as defined by claim 13 further comprising:

an interior interface pad within the first interior volume; and

first and second wire bonds within the interior volume,

the first wire bond electrically connecting the microphone to the circuit chip,

the second wire bond electrically connecting the circuit chip to the interior interface pad,

the microphone electrically connecting with the exterior interface pad or the second side through the first wire bond, circuit chip, second wire bond, and interior interface pad.

18. A microphone module comprising:

a substrate having an aperture to allow sound waves to pass through the substrate;

a lid mounted to the substrate, the lid and substrate defining a first interior volume;

a microphone mounted to the substrate within the first interior volume;

a housing coupled to the substrate and covering the aperture, the housing forming a second interior volume, the housing including an acoustic port configured to allow sound to enter the second interior volume;

a pipe extending from the acoustic port in the housing, the pipe having an open end to receive sound waves and direct them toward the acoustic port in the housing; and

at least one exterior interface pad outside of the second interior volume, the at least one exterior interface pad electrically coupled to the microphone.

19. The microphone module as defined by claim 18 wherein the at least one exterior interface pad is surface mountable.