Method of fabrication an ultra-thin quartz resonator

• US 8,769,802 B1
• Filed: 07/06/2010
• Issued: 07/08/2014
• Est. Priority Date: 02/21/2008
• Status: Active Grant

• Current Assignee: HRL Laboratories LLC (The Boeing Co.)
• Original Assignee: HRL Laboratories LLC (The Boeing Co.)
• Inventors: Chang, David T., Kubena, Randall L., Patterson, Pamela R.
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US12/831,028
• Time in Patent Office: 1,463 Days
• Field of Search: 295921-595, 296/091, 296/00, 296/01, 310321-328, 310/330, 310/331, 310311-313, 451/5, 451/41, 438/459, 381396-398, 181171-172
• US Class Current: 29/594
• CPC Class Codes: H03H 3/04 for obtaining desired frequency or temperature coefficient
• CPC Class Codes: H03H 9/172 Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer

Abstract

A method for manufacturing a resonator is presented in the present application. The method includes providing a handle substrate, providing a host substrate, providing a quartz substrate comprising a first surface opposite a second surface, applying interposer film to the first surface of the quartz substrate, bonding the quartz substrate to the handle substrate wherein the interposer film is disposed between the quartz substrate and the handle substrate, thinning the second surface of the quartz substrate, removing a portion of the bonded quartz substrate to expose a portion of the interposer film, bonding the quartz substrate to the host substrate, and removing the handle substrate and the interposer film, thereby releasing the quartz substrate.

Claims

1. A method for fabricating a resonator comprising:

receiving a handle substrate;

receiving a quartz substrate comprising a first surface opposite a second surface;

applying an interposer film to the first surface of the quartz substrate;

bonding the handle substrate to the interposer film;

thinning the second surface of the quartz substrate;

forming at least one metallized via in the quartz substrate;

receiving a host substrate;

bonding the quartz substrate to the host substrate; and

removing the handle substrate, thereby releasing the quartz substrate.

2. The method of claim 1, the method further comprising:

forming a first electrode on the first surface;

forming a first interconnect pad on the first surface electrically connected to the first electrode;

forming a second electrode on the second surface of the quartz substrate;

forming a second interconnect pad on the second surface electrically connected to the second electrode; and

forming a third interconnect pad on the second surface electrically connected to the first interconnect pad.

3. The method of claim 2, wherein the first electrode and the second electrode formed on the quartz substrate comprise Al, Ti/Au or Cr/Au.