Backlight module for liquid crystal display and liquid crystal display

• US 8,770,805 B2
• Filed: 12/03/2011
• Issued: 07/08/2014
• Est. Priority Date: 07/18/2011
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Chang, Kuang-yao, Huang, Jianfa, Hu, Chechang
• Primary Examiner(s): RALEIGH, DONALD L
• Application Number:
  US13/380,871
• Publication Number:
  US 20130294052A1
• Time in Patent Office: 948 Days
• Field of Search: 362/612, 362/294, 362/264, 362/373, 349/58, 349/161
• US Class Current: 362/373
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133615 Edge-illuminating devices, i.e. illuminating from the side
• CPC Class Codes: G02F 1/133628 with cooling means

Abstract

The utility model discloses a backlight module for a liquid crystal display device and a liquid crystal display device. The backlight module comprises an LED and a backplane, wherein the backlight module also comprises a heatsink plate arranged on the outer of the backplane; and the LED is linked with the heatsink plate in the mode of heat conduction. The utility model, by arranging the LED on an extra heatsink plate which is arranged on the outer of the backplane, dissipates outward the heat emitted by the LED through the heatsink plate, lowers the temperature of the backlight cavity, and protects the optical components. At the same time, because the backplane is not directly used to dissipate heat, the gradient of temperature distribution on the backplane is reduced, thus, the gradient of temperature distribution in the backlight cavity is reduced and stress of the backlight cavity induced by the temperature gradient is also reduced.

Claims

1. A backlight module for a liquid crystal display device, comprising:

an LED, a light guide plate, and a backplane directly contacts with the light guide plate;

said backlight module also comprises a heatsink plate arranged on the outside of the backplane; and

said LED is linked with the heatsink plate in a mode of heat conduction;

wherein an isolating layer is arranged between said heatsink plate and said backplane, and said isolating layer is an air layer, wherein the thickness range of said air layer is from 0.5 mm to 4 mm.

2. The backlight module for the liquid crystal display device of claim 1, wherein said isolating layer is of a heat-insulating material arranged between said heatsink plate and said backplane.

3. The backlight module for the liquid crystal display device of claim 2, wherein said heat-insulating material is of the material that the coefficient of thermal conductivity is less than 1 W/mK.

4. The backlight module for the liquid crystal display device of claim 2, wherein said heat-insulating material is of a foamed plastic.

5. The backlight module for the liquid crystal display device of claim 1, wherein said backlight module also comprises a conduction plate for fixing the LED;

said LED is linked with the heatsink plate in the mode of heat conduction through the conduction plate;

said conduction plate and said heatsink plate are formed by bending one plate;

said conduction plate is perpendicular to the backplane; and

said heatsink plate is parallel to the backplane.

6. The backlight module for the liquid crystal display device of claim 1, wherein said backlight module comprises a PCB circuit board;

said LED is directly arranged on the PCB circuit board; and

said LED is arranged on the heatsink plate through the PCB circuit board.

7. A liquid crystal display device, comprising:

a backlight module, the backlight module comprises an LED, a light guide plate, and a backplane directly contacts with the light guide plate;

said backlight module also comprises a heatsink plate arranged on the outside of the backplane; and

said LED is linked with said heatsink plate in the mode of heat conduction;

wherein an isolating layer is arranged between said heatsink plate and said backplane, and said isolating layer is an air layer, wherein the thickness range of said air layer is from 0.5 mm to 4 mm.

8. The liquid crystal display device of claim 7, wherein said isolating layer is of a heat-insulating material arranged between said heatsink plate and said backplane.

9. The liquid crystal display device of claim 8, wherein said heat-insulating material is of the material that the coefficient of thermal conductivity is less than 1 W/mK.

10. The liquid crystal display device of claim 8, wherein said heat-insulating material is of a foamed plastic.

11. The liquid crystal display device of claim 7, wherein said backlight module also comprises a conduction plate for fixing the LED;

said LED is linked with the heatsink plate in the mode of heat conduction through the conduction plate;

said conduction plate and said heatsink plate are formed by bending one plate;

said conduction plate is perpendicular to the backplane; and

said heatsink plate is parallel to the backplane.

12. The liquid crystal display device of claim 7, wherein said backlight module comprises a PCB circuit board;

said LED is directly arranged on the PCB circuit board; and

said LED is arranged on the heatsink plate through the PCB circuit board.