Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
First Claim
1. A light emitting device, comprising:
- a low defect density base structure comprising;
a substrate;
a GaN-based buffer layer having a first smooth surface that is directly on the substrate and a second smooth surface that is remote from the substrate;
a dielectric layer on the second smooth surface that is remote from the substrate; and
a GaN layer on the dielectric layer remote from the GaN-based buffer layer;
a quantum well active region on the low defect density base structure that emits light, the quantum well active region comprising;
a first barrier layer comprising AlGaN;
a first well layer comprising GaN directly on the first barrier layer;
a second barrier layer comprising AlGaN directly on the first well layer;
a second well layer comprising GaN directly on the second barrier layer; and
a third barrier layer comprising AlGaN directly on the second well layer;
an AlGaN layer on the quantum well active region; and
a GaN based contact layer on the AlGaN layer.
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Accused Products
Abstract
Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 360 nm with wall plug efficiencies of at least than 4% are provided. Wall plug efficiencies may be at least 5% or at least 6%. Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 345 nm with wall plug efficiencies of at least than 2% are also provided. Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 330 nm with wall plug efficiencies of at least than 0.4% are provided. Light emitting devices and methods of fabricating light emitting devices having a peak output wavelength of not greater than 360 nm and an output power of at least 5 mW, having a peak output wavelength of 345 nm or less and an output power of at least 3 mW and/or a peak output wavelength of 330 nm or less and an output power of at least 0.3 mW at a current density of less than about 0.35 μA/μm2 are also provided. The semiconductor light emitting devices may have a direct current lifetime of at least 100 hours, at least 500 hours or at least 1000 hours.
140 Citations
42 Claims
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1. A light emitting device, comprising:
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a low defect density base structure comprising; a substrate; a GaN-based buffer layer having a first smooth surface that is directly on the substrate and a second smooth surface that is remote from the substrate; a dielectric layer on the second smooth surface that is remote from the substrate; and a GaN layer on the dielectric layer remote from the GaN-based buffer layer; a quantum well active region on the low defect density base structure that emits light, the quantum well active region comprising; a first barrier layer comprising AlGaN; a first well layer comprising GaN directly on the first barrier layer; a second barrier layer comprising AlGaN directly on the first well layer; a second well layer comprising GaN directly on the second barrier layer; and a third barrier layer comprising AlGaN directly on the second well layer; an AlGaN layer on the quantum well active region; and a GaN based contact layer on the AlGaN layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method of fabricating a light emitting device, comprising:
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forming a low defect density base structure comprising; a substrate; a GaN-based buffer layer having a first smooth surface that is directly on the substrate and a second smooth surface that is remote from the substrate; a dielectric layer on the second smooth surface that is remote from the substrate; and a GaN layer on the dielectric layer remote from the GaN-based buffer layer; forming a quantum well active region on the low defect density base structure that emits light, the quantum well active region comprising; a first barrier layer comprising AlGaN; a first well layer comprising GaN directly on the first barrier layer; a second barrier layer comprising AlGaN directly on the first well layer; a second well layer comprising GaN directly on the second barrier layer; and a third barrier layer comprising AlGaN directly on the second well layer; forming an AlGaN layer on the quantum well active region; and forming a GaN based contact layer on the AlGaN layer. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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Specification