High efficiency light emitting diode and method for fabricating the same
First Claim
1. A light emitting diode (LED) comprising:
- a support substrate;
a semiconductor stack disposed on the support substrate, the semiconductor stack comprising a p-type compound semiconductor layer, an n-type compound semiconductor layer, and an active layer disposed between the p-type compound semiconductor layer and the n-type compound semiconductor layer, the p-type compound semiconductor layer being disposed closer to the support substrate than the n-type compound semiconductor layer, the semiconductor stack having a first opening that divides the p-type compound semiconductor layer and the active layer, and exposes a portion of the n-type compound semiconductor layer, the portion facing the support substrate;
an insulating layer disposed on the exposed portion of the n-type compound semiconductor layer and a sidewall of the opening;
a transparent electrode layer disposed in ohmic-contact with the p-type compound semiconductor layer and covering the insulating layer and the p-type compound semiconductor layer;
a reflective layer covering the transparent electrode layer, to reflect light emitted from the active layer away from the support substrate;
a p-electrode covering the reflective layer; and
an n-electrode disposed on an upper surface of the n-type compound semiconductor layer,wherein the p-electrode is electrically connected to the transparent electrode layer through at least one second opening formed in the reflective insulating layer,wherein a width of the first opening decreases as it approaches the n-type compound semiconductor layer.
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Abstract
A high-efficiency light emitting diode including: a semiconductor stack positioned on a support substrate, including a p-type compound semiconductor layer, an active layer, and an n-type compound semiconductor layer; an insulating layer disposed in an opening that divides the p-type compound semiconductor layer and active layer; a transparent electrode layer disposed on the insulating layer and the p-type compound semiconductor layer; a reflective insulating layer covering the transparent electrode layer, to reflect light from the active layer away from the support substrate; a p-electrode covering the reflective insulating layer; and an n-electrode is formed on top of the n-type compound semiconductor layer. The p-electrode is electrically connected to the transparent electrode layer through the insulating layer.
12 Citations
23 Claims
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1. A light emitting diode (LED) comprising:
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a support substrate; a semiconductor stack disposed on the support substrate, the semiconductor stack comprising a p-type compound semiconductor layer, an n-type compound semiconductor layer, and an active layer disposed between the p-type compound semiconductor layer and the n-type compound semiconductor layer, the p-type compound semiconductor layer being disposed closer to the support substrate than the n-type compound semiconductor layer, the semiconductor stack having a first opening that divides the p-type compound semiconductor layer and the active layer, and exposes a portion of the n-type compound semiconductor layer, the portion facing the support substrate; an insulating layer disposed on the exposed portion of the n-type compound semiconductor layer and a sidewall of the opening; a transparent electrode layer disposed in ohmic-contact with the p-type compound semiconductor layer and covering the insulating layer and the p-type compound semiconductor layer; a reflective layer covering the transparent electrode layer, to reflect light emitted from the active layer away from the support substrate; a p-electrode covering the reflective layer; and an n-electrode disposed on an upper surface of the n-type compound semiconductor layer, wherein the p-electrode is electrically connected to the transparent electrode layer through at least one second opening formed in the reflective insulating layer, wherein a width of the first opening decreases as it approaches the n-type compound semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A light emitting diode (LED) comprising:
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a support substrate; a semiconductor stack disposed on the support substrate and having an upper surface that faces away from the substrate, the semiconductor stack comprising a p-type compound semiconductor layer, an n-type compound semiconductor layer, and an active layer disposed between the p-type compound semiconductor layer and the n-type compound semiconductor layer; a first electrode disposed between the support substrate and the semiconductor stack, in ohmic-contact with the semiconductor stack, the first electrode having a first portion that extends into the semiconductor stack to be disposed in the active layer, and a second portion that extends outside of the semiconductor stack; a first bonding pad disposed on the second portion of the first electrode outside of the semiconductor stack, the first bonding pad being electrically connected to the first electrode; and a second electrode positioned on the upper surface of the semiconductor stack, wherein first protrusions are formed on the upper surface of the semiconductor stack, and a dielectric material is disposed on the upper surface, covering the first protrusions, the dielectric material comprising second protrusions disposed on the first protrusions. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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Specification