Light emitting diode package structure and manufacturing method thereof

• US 8,772,807 B2
• Filed: 05/27/2011
• Issued: 07/08/2014
• Est. Priority Date: 09/30/2010
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Lin, Hsien Chia
• Primary Examiner(s): Toledo, Fernando L
• Assistant Examiner(s): HALL, VICTORIA KATHLEEN
• Application Number:
  US13/118,007
• Publication Number:
  US 20120080702A1
• Time in Patent Office: 1,138 Days
• Field of Search: 257 79-103, 257E33001-E33077, 257/E33.061, 257/E33.062, 257/E33.065, 257/E33.066, 257/E33.055, 257/E33.056, 257/E33.057, 257/E33.071, 438 22- 47
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

In one aspect, an LED package structure comprises a fluorescent substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The fluorescent substrate has a first surface and a second surface opposite the first surface. The fluorescent substrate comprises a mixture of a fluorescent material and a glass material. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The electrically conductive element passes through the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the electrically conductive element.

Claims

1. A light emitting diode (LED) package structure, comprising:

a fluorescent substrate having a first surface and a second surface opposite the first surface, the fluorescent substrate comprising a fluorescent material and a glass material, the fluorescent substrate having a through hole that traverses through the fluorescent substrate from the first surface to the second surface;

a first electrically conductive pattern disposed on the first surface of the fluorescent substrate;

a second electrically conductive pattern disposed on the second surface of the fluorescent substrate;

an electrically conductive component filled in the through hole and connecting the first electrically conductive pattern and the second electrically conductive pattern; and

a plurality of LED chips including first and second LED chips disposed on the second surface of the fluorescent substrate with the first LED chip aligned with the through hole and the second LED chip not aligned with the through hole, each of the first and second LED chips having a light extraction surface coupled to the second electrically conductive pattern such that the first and second LED chips are electrically coupled to the first electrically conductive pattern via the second electrically conductive pattern and the electrically conductive component.

2. The LED package structure of claim 1, wherein a thickness of the fluorescent substrate is approximately constant throughout the fluorescent substrate.

3. The LED package structure of claim 1, wherein the fluorescent material comprises yellow phosphor.

4. The LED package structure of claim 1, wherein the fluorescent material comprises phosphors of at least two different wavelengths.

5. The LED package structure of claim 4, wherein the phosphors comprise at least two of yellow phosphor, red phosphor, and green phosphor.

6. The LED package structure of claim 1, further comprising an underfill disposed between the light extraction surface of the first and second LED chips and the second surface of the fluorescent substrate, the underfill covering at least partially the light extraction surface of the first and second LED chips.

7. The LED package structure of claim 6, wherein the underfill covers a plurality of side surfaces of the first and second LED chips partially and not completely.

8. The LED package structure of claim 7, wherein the first and second LED chip comprise a sapphire substrate.

9. The LED package structure of claim 1, further comprising a circuit line substrate, a back surface of each of the first and second LED chips opposite the light extraction surface disposed on the circuit line substrate.

10. The LED package structure of claim 9, further comprising at least one bonding wire that electrically couples the circuit line substrate and the first electrically conductive pattern.