Integrally molded die and bezel structure for fingerprint sensors and the like
First Claim
Patent Images
1. A fingerprint sensor device, comprising:
- a substrate;
a die comprising fingerprint sensing circuitry and being secured to said substrate;
a first conductive bezel secured to said substrate adjacent said die; and
an encapsulation structure integrally encasing at least a portion of said die and a portion of said first conductive bezel;
said die including a top surface configured to be electrically coupled with a fingertip;
said first conductive bezel including a top surface positioned with respect to the top surface of said die and configured to be electrically coupled with the fingertip.
3 Assignments
0 Petitions
Accused Products
Abstract
A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.
-
Citations
32 Claims
-
1. A fingerprint sensor device, comprising:
-
a substrate; a die comprising fingerprint sensing circuitry and being secured to said substrate; a first conductive bezel secured to said substrate adjacent said die; and an encapsulation structure integrally encasing at least a portion of said die and a portion of said first conductive bezel; said die including a top surface configured to be electrically coupled with a fingertip; said first conductive bezel including a top surface positioned with respect to the top surface of said die and configured to be electrically coupled with the fingertip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A fingerprint sensor assembly comprising:
-
a substrate; a die comprising a fingerprint sensing array and secured to said substrate; a first conductive bezel secured to said substrate adjacent said die; a second conductive bezel secured to said substrate adjacent said die such that said die is between said first and second conductive bezels; and an encapsulation structure integrally encapsulating said die, said first conductive bezel, and said second conductive bezel, such that said fingerprint sensing array and at least a portion of a top surface of each of said first conductive bezel and said second conductive bezel are configured to be electrically coupled with a fingertip. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
-
-
23. A method of making a fingerprint sensor device, the method comprising:
-
securing a die comprising fingerprint sensing circuitry to a substrate; securing a first conductive bezel to said substrate adjacent said die; and integrally encasing at least a portion of said die and a portion of said first conductive bezel with an encapsulation structure; said die including a top surface configured to be electrically coupled with a fingertip; said first conductive bezel including a top surface positioned with respect to the top surface of said die and configured to be electrically coupled with the fingertip. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32)
-
Specification