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Integrally molded die and bezel structure for fingerprint sensors and the like

  • US 8,772,884 B2
  • Filed: 08/06/2013
  • Issued: 07/08/2014
  • Est. Priority Date: 03/05/2010
  • Status: Expired due to Fees
First Claim
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1. A fingerprint sensor device, comprising:

  • a substrate;

    a die comprising fingerprint sensing circuitry and being secured to said substrate;

    a first conductive bezel secured to said substrate adjacent said die; and

    an encapsulation structure integrally encasing at least a portion of said die and a portion of said first conductive bezel;

    said die including a top surface configured to be electrically coupled with a fingertip;

    said first conductive bezel including a top surface positioned with respect to the top surface of said die and configured to be electrically coupled with the fingertip.

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