Semiconductor device and programming method
First Claim
1. A method for fabricating a semiconductor device comprising:
- mounting a semiconductor chip on a chip mounting portion;
coupling a wire between the semiconductor chip and the chip mounting portiondisposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion; and
forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip, wherein the wire is provided in contact with the sheet-shaped resin portion.
6 Assignments
0 Petitions
Accused Products
Abstract
The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
-
Citations
24 Claims
-
1. A method for fabricating a semiconductor device comprising:
-
mounting a semiconductor chip on a chip mounting portion; coupling a wire between the semiconductor chip and the chip mounting portion disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion; and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip, wherein the wire is provided in contact with the sheet-shaped resin portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A wireless communications device, comprising:
-
a memory comprising; a semiconductor chip; a chip mounting portion mounting the semiconductor chip; a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion; a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion; a processor; a communications component; a transmitter; a receiver; and an antenna connected to the transmitter circuit and the receiver circuit. - View Dependent Claims (11, 12, 13, 14)
-
-
15. A computing device comprising:
-
a processor; an input component; an output component; a memory comprising; a semiconductor chip; a chip mounting portion mounting the semiconductor chip; a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion; a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion. - View Dependent Claims (16, 17, 18, 19)
-
-
20. A portable media player comprising:
-
a processor; a cache; a user input component; a coder-decoder component; and a memory comprising; a semiconductor chip; a chip mounting portion mounting the semiconductor chip; a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion; a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion. - View Dependent Claims (21, 22, 23, 24)
-
Specification