Signal amplification by hierarchal resonating structures

• US 8,772,999 B2
• Filed: 10/11/2007
• Issued: 07/08/2014
• Est. Priority Date: 10/11/2007
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Sand 9, Inc. (Analog Devices, Inc.)
• Inventors: Mohanty, Pritiraj, Gaidarzhy, Alexei, Zolfagharkhani, Guiti, Hashemi, Fardad
• Primary Examiner(s): DOUGHERTY, THOMAS M
• Application Number:
  US12/681,428
• Publication Number:
  US 20110121682A1
• Time in Patent Office: 2,462 Days
• Field of Search: 310/309, 331/154, 331/116, 735/040.4
• US Class Current: 310/309
• CPC Class Codes: H03H 2009/02488 Vibration modes
• CPC Class Codes: H03H 9/02244 of microelectro-mechanical resonators
• CPC Class Codes: H03H 9/2405 of microelectro-mechanical resonators

Abstract

An electromechanical resonating structure, including: first level major elements coupled to each other to form a second or higher level hierarchy; and first level sub-micron size minor elements with a characteristic frequency and coupled to each of the first level major elements to form a second level hierarchy in which a signal is effectively amplified by vibrating each of the plurality of major elements in at least one mode determined by the geometry and dimensions of the first level sub-micron minor elements.

Claims

1. An electromechanical resonating structure, comprising:

a first plurality of sub-micron size elements configured to resonate at a characteristic frequency and coupled to at least one first flexible structure, the first plurality of elements and the at least one first flexible structure collectively defining a first resonating structure;

a second plurality of sub-micron size elements configured to resonate at the characteristic frequency and coupled to at least one second flexible structure, the second plurality of elements and the at least one second flexible structure collectively defining a second resonating structure; and

at least one flexible support coupling the first resonating structure to the second resonating structure, the first and second resonating structures and the at least one flexible support collectively defining a third level resonating structure,

wherein the third level resonating structure is configured to resonate in at least one mode at a frequency different from the characteristic frequency and determined by a geometry and material of the first and second pluralities of elements, and is configured to resonate with an amplitude greater than amplitudes of vibration exhibited by the first and second pluralities of elements.

2. The electromechanical resonating structure of claim 1 wherein the third level resonating structure is a first third level resonating structure and is coupled to a second substantially identical third level resonating structure, the first and second third level resonating structures collectively defining a fourth level resonating structure.

3. The electromechanical resonating structure of claim 1 wherein a length of the at least one flexible support is configured to produce a low order frequency mode substantially matching a collective frequency mode of the first and second pluralities of elements.

4. A biocompatible medical robot comprising the electromechanical resonating structure of claim 1.

5. The electromechanical resonating structure of claim 1 wherein the at least one flexible support is located in one or more areas determined to optimize dampening due to the at least one flexible support.

6. The electromechanical resonating structure of claim 1 wherein at least one of the first and second resonating structures form a curved or a serpentine structure.

7. The electromechanical resonating structure of claim 1 wherein each of the first and second pluralities of elements are rectangular in shape.

8. An electromechanical resonating structure, comprising:

a first plurality of sub-micron size elements configured to resonate at a characteristic frequency and coupled to at least one first flexible structure, the first plurality of elements and the at least one first flexible structure collectively defining a first resonating structure;

a second plurality of sub-micron size elements configured to resonate at the characteristic frequency and coupled to at least one second flexible structure, the second plurality of elements and the at least one second flexible structure collectively defining a second resonating structure;

at least one flexible support coupling the first resonating structure to the second resonating structure, the first and second resonating structures and the at least one flexible support collectively defining a first third level resonating structure;

a second third level resonating structure coupled to the first third level resonating structure, the first and second third level resonating structures collectively defining a first fourth level resonating structure; and

a second fourth level resonating structure coupled to the first fourth level resonating structure,

wherein the first fourth level resonating structure is configured to resonate in at least one mode at a frequency different from the characteristic frequency and determined by a geometry and material of the first and second pluralities of elements, and is configured to resonate with an amplitude greater than amplitudes of vibration exhibited by the first and second pluralities of elements.

9. The electromechanical resonating structure of claim 8 wherein a geometry and material of the at least one flexible support is configured to produce a low order frequency mode substantially matching a collective frequency mode of the first and second pluralities of elements.

10. The electromechanical resonating structure of claim 8 wherein a geometry and material of a coupling element that couples the first fourth level resonating structure to the second fourth level resonating structure is configured to produce a low order frequency mode substantially matching a collective frequency mode of the first and second pluralities of elements.

11. The electromechanical resonating structure of claim 8 further including a plurality of anchors between the first plurality of sub-micron size elements and the first flexible structure configured to transduce a signal.

12. The electromechanical resonating structure of claim 11 wherein the plurality of anchors are configured to select an amplification and a directionality of the signal.

13. The electromechanical resonating structure of claim 11 wherein a size and a shape of each of the plurality of anchors are so defined that a signal transmission along any direction is allowed or inhibited.

14. The electromechanical resonating structure of claim 8 wherein the at least one flexible support is located in one or more areas determined to optimize dampening due to the at least one flexible support.

15. The electromechanical resonating structure of claim 8 wherein at least one of first and second resonating structures form a curved or a serpentine structure.

16. The electromechanical resonating structure of claim 8 wherein each of the first and second pluralities of elements are rectangular in shape.

17. An electromechanical resonating structure, comprising:

a first plurality of sub-micron size elements configured to resonate at a characteristic frequency and coupled to at least one first flexible structure, the first plurality of elements and the at least one first flexible structure collectively defining a first resonating structure;

a second plurality of sub-micron size elements configured to resonate at the characteristic frequency and coupled to at least one second flexible structure, the second plurality of elements and the at least one second flexible structure collectively defining a second resonating structure;

at least one flexible support coupling the first resonating structure to the second resonating structure, the first and second resonating structures and the at least one flexible support collectively defining a first third level resonating structure;

a second third level resonating structure coupled to the first third level resonating structure, the first and second third level resonating structures collectively defining a first fourth level resonating structure;

a second fourth level resonating structure coupled to the first fourth level resonating structure; and

a plurality of anchors between the first plurality of sub-micron size elements and the first flexible structure,

wherein the first fourth level resonating structure is configured to resonate in at least one mode at a frequency different from the characteristic frequency and determined by a geometry and material of the first and second pluralities of elements, and is configured to resonate with an amplitude greater than amplitudes of vibration exhibited by the first and second pluralities of elements, and

wherein a length of a coupling element that couples the first fourth level resonating structure to the second fourth level resonating structure is configured to produce a low order frequency mode substantially the same as a collective frequency mode of the first and second pluralities of elements.