Touch-responsive capacitor with polarizing dielectric method

• US 8,773,395 B2
• Filed: 04/24/2012
• Issued: 07/08/2014
• Est. Priority Date: 04/24/2012
• Status: Active Grant

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Cok, Ronald Steven, O'Toole, Terrence Robert
• Primary Examiner(s): SHENG, TOM V
• Application Number:
  US13/454,153
• Publication Number:
  US 20130278545A1
• Time in Patent Office: 805 Days
• Field of Search: 345/173, 345/174
• US Class Current: 345/174
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer

Abstract

A method of making a touch-responsive capacitive apparatus, includes providing a polarizing dielectric structure having a first surface and a second opposed surface, first and second conductive precursor material layers on the first and second surfaces, respectively; exposing the first conductive precursor material layer with first patterned polarized light having an orientation that is absorbed by the polarizing dielectric substrate so that the second conductive precursor material layer is not exposed; exposing the second conductive precursor material layer with second patterned polarized light having an orientation that is absorbed by the polarizing dielectric substrate so that the first conductive precursor material layer is not exposed; processing the exposed first conductive precursor material layer to form a first conductive material pattern on the first surface; and processing the exposed second conductive precursor material layer to form a second conductive material pattern on the second surface.

Claims

1. A method of making a touch-responsive capacitive apparatus, comprising:

providing a polarizing dielectric structure having a first surface and a second surface opposed to the first surface, a first conductive precursor material layer on the first surface, and a second conductive precursor material layer on the second surface;

exposing the first conductive precursor material layer with first patterned polarized light, the first patterned polarized light having an orientation that is absorbed by the polarizing dielectric substrate so that the second conductive precursor material layer is not exposed;

exposing the second conductive precursor material layer with second patterned polarized light, the second patterned polarized light having an orientation that is absorbed by the polarizing dielectric substrate so that the first conductive precursor material layer is not exposed;

processing the exposed first conductive precursor material layer to form a first conductive material pattern on the first surface; and

processing the exposed second conductive precursor material layer to form a second conductive material pattern on the second surface.

2. The method according to claim 1, wherein the providing step includes receiving or forming the polarizing dielectric structure and forming the first conductive precursor material layer on the first surface and the second conductive precursor material layer on the second surface.

3. The method according to claim 1, wherein the providing step includes receiving the polarizing dielectric structure with the first conductive precursor material layer on the first surface and the second conductive precursor material layer on the second surface.

4. The method according to claim 1, wherein the first conductive material pattern forms a first conductive mesh of first micro-wires.

5. The method according to claim 1, wherein the second conductive material pattern forms a second conductive mesh of second micro-wires.

6. The method according to claim 1, wherein the polarizing dielectric structure is a linearly polarizing dielectric structure.

7. The method according to claim 6, wherein the first patterned polarized light is orthogonally oriented to the linearly polarizing dielectric structure.

8. The method according to claim 6, wherein the second conductive precursor material layer with second patterned polarized light is orthogonally oriented to the linearly polarizing dielectric structure.

9. The method according to claim 1, substrate wherein the polarizing dielectric structure is a linearly polarizing dielectric substrate having the first and second surfaces.

10. The method according to claim 1, including providing a first substrate having the first surface, providing a second substrate having the second surface, and locating a linearly polarizing dielectric substrate between the first substrate and the second substrate.

11. The method according to claim 1, including providing a linearly polarizing dielectric substrate having the first surface and providing a second substrate having the second surface.

12. The method according to claim 1 wherein either of the first or second conductive precursor material layers includes a photosensitive conductive precursor material provided in a binder material.

13. The method according to claim 12 wherein the photosensitive conductive precursor material includes a silver halide and the binder material includes a gelatin.

14. The method according to claim 12 wherein the photosensitive conductive precursor material is a conductive ink.

15. The method according to claim 1 wherein the first or second conductive precursor material layers each include a metallic particulate material or a metallic conductive precursor material, and a photosensitive binder material.

16. The method according to claim 15, wherein processing the exposed first and second precursor material layers includes curing the exposed portions of the first and second conductive precursor material layers and removing the uncured portions to form the first or second micro-wires.

17. The method according to claim 1, wherein the first conductive precursor material layer is pattern-wise exposed in a first step and the second conductive precursor material layer is pattern-wise exposed in a second step different from the first step.

18. The method according to claim 1, wherein the first conductive precursor material layer and the second conductive precursor material layer are pattern-wise exposed in a common step.

19. The method according to claim 1, wherein the exposed first conductive precursor material layer and the exposed second conductive precursor material layer are processed in a common step.

20. A method of making a touch-responsive capacitive apparatus, comprising:

providing a polarizing dielectric structure having a first surface and a second surface opposed to the first surface, a first conductive precursor material layer on the first surface, and a second conductive precursor material layer on the second surface;

exposing the first conductive precursor material layer with first patterned polarized light, the first patterned polarized light having an orientation that is absorbed by the polarizing dielectric substrate so that the second conductive precursor material layer is not exposed;

processing the exposed first conductive precursor material layer to form a first material pattern on the first surface;

exposing the second conductive precursor material layer through the polarizing dielectric structure with second patterned light, the second patterned light having an orientation that is at least partially transmitted by the polarizing dielectric substrate so that the second conductive precursor material layer is exposed; and

processing the exposed second conductive precursor material layer to form a second material pattern on the second surface.