Enclosure assembly housing at least one electronic board assembly and systems using same
First Claim
1. An enclosure assembly, comprising:
- an enclosure including an interior surface defining an interior space and an inner diameter; and
at least one electronic board assembly positioned within the interior space and including a first peripheral edge region and an opposing second peripheral edge region, the at least one electronic board assembly extending diametrically so that the first and second peripheral edge regions are at least proximate to the interior surface, the electronic board assembly comprising a PCI mezzanine board having a PCI bus interface wherein the first and second peripheral edge regions comprise edges other than the PCI bus interface.
1 Assignment
0 Petitions
Accused Products
Abstract
Various embodiments of the invention relate to enclosure assemblies housing at least one electronic board assembly and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In an embodiment, an enclosure assembly includes an enclosure having an interior surface defining an interior space and an inner diameter. At least one electronic board assembly is positioned within the interior space and includes a first peripheral edge region and an opposing second peripheral edge region. The electronic board assembly extends diametrically so that the first and second peripheral edge regions are at least proximate to the interior surface. In another embodiment, a plurality of electronic board assemblies are positioned within the interior space and each extends generally along a respective non-diametric chord defined by the interior surface.
-
Citations
25 Claims
-
1. An enclosure assembly, comprising:
-
an enclosure including an interior surface defining an interior space and an inner diameter; and at least one electronic board assembly positioned within the interior space and including a first peripheral edge region and an opposing second peripheral edge region, the at least one electronic board assembly extending diametrically so that the first and second peripheral edge regions are at least proximate to the interior surface, the electronic board assembly comprising a PCI mezzanine board having a PCI bus interface wherein the first and second peripheral edge regions comprise edges other than the PCI bus interface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. An enclosure assembly, comprising:
- an enclosure including an interior surface defining an interior space and a plurality of non-diametric chords; and
a plurality of electronic board assemblies positioned within the interior space and each including a first peripheral edge region having a high-thermal conductivity interface and an opposing second peripheral edge region having a high-thermal conductivity interface, each electronic board assembly extending generally along a respective one of the non-diametric chords so that the first and second peripheral edge regions thereof are interface with the interior surface such that heat is transferred from the plurality of electronic board assemblies to the enclosure;
wherein each electronic board assembly further comprises a PCI mezzanine board having a PCI bus interface wherein the first and second peripheral edge regions comprise edges other than the PCI bus interface. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
- an enclosure including an interior surface defining an interior space and a plurality of non-diametric chords; and
-
20. A system, comprising:
-
an enclosure assembly including; an enclosure including an interior surface defining an interior space and an inner diameter; and at least one electronic board assembly positioned within the interior space and including a first peripheral edge region and an opposing second peripheral edge region, the at least one electronic board assembly extending diametrically so that the first and second peripheral edge regions are extended through the interior surface; and a propulsion system operatively coupled to the at least one electronics module. - View Dependent Claims (21, 22)
-
-
23. A system, comprising:
-
an enclosure assembly including; an enclosure including an interior surface defining an interior space and a plurality of non-diametric chords; and a plurality of electronic board assemblies each including a first peripheral edge region and an opposing second peripheral edge region, each electronic board assembly extending generally along a respective one of the non-diametric chords so that the first and second peripheral edge regions thereof are extended through the interior surface; and a propulsion system operatively coupled to the at least one electronics module. - View Dependent Claims (24, 25)
-
Specification