Detecting defects on a wafer

• US 8,775,101 B2
• Filed: 08/02/2011
• Issued: 07/08/2014
• Est. Priority Date: 02/13/2009
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation (KLA Corporation)
• Original Assignee: KLA-Tencor Corporation (KLA Corporation)
• Inventors: Huang, Junqing, Zhang, Yong, Chen, Stephanie, Luo, Tao, Gao, Lisheng, Wallingford, Richard
• Primary Examiner(s): Bui, Bryan
• Application Number:
  US13/196,758
• Publication Number:
  US 20130035876A1
• Time in Patent Office: 1,071 Days
• Field of Search: 702/40
• US Class Current: 702/40
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01R 31/28 Testing of electronic circuits, e.g. by signal tracer EMC, EMP or similar testing of electronic circuits G01R31/002; testing for short-circuits, discontinuities, leakage or incorrect line connection G01R31/50; checking computers or computer components G06F11/00; checking static stores for correct operation G11C29/00 ; testing receivers or transmitters of transmission systems H04B17/00

Abstract

Methods and systems for detecting defects on a wafer are provided.

Claims

1. A computer-implemented method for detecting defects on a wafer, comprising:

acquiring raw output for a wafer generated by an inspection system;

identifying one or more characteristics of the raw output that correspond to one or more geometrical characteristics of patterned features formed on the wafer;

assigning individual output in the raw output to different segments based on the identified one or more characteristics of the raw output such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments are different, wherein the one or more geometrical characteristics that correspond to one of the different segments comprise one or more geometrical characteristics of page breaks, and wherein the one or more geometrical characteristics that correspond to another of the different segments comprise one or more geometrical characteristics of array areas;

separately assigning one or more defect detection parameters to the different segments; and

applying the assigned one or more defect detection parameters to the individual output assigned to the different segments to thereby detect defects on the wafer.

2. The method of claim 1, wherein the raw output is responsive to light scattered from the wafer.

3. The method of claim 1, wherein the identified one or more characteristics of the raw output comprise projections along lines within the raw output.

4. The method of claim 1, wherein the one or more geometrical characteristics of the patterned features comprise edges, shape, texture, a mathematical calculation that defines geometry of the patterned features, or some combination thereof.

5. The method of claim 1, wherein said identifying is performed based on how a design layout of the patterned features will affect the one or more characteristics of the raw output.

6. The method of claim 1, wherein said identifying is performed while said acquiring is being performed.

7. The method of claim 1, wherein said identifying and said assigning the individual output are performed automatically without user input.

8. The method of claim 1, wherein said assigning the individual output is performed without regard to design data associated with the patterned features.

9. The method of claim 1, wherein said assigning the individual output is performed without regard to intensity of the individual output.

10. The method of claim 1, wherein said assigning the individual output comprises analyzing the identified one or more characteristics of the raw output and applying thresholds to the individual output.

11. The method of claim 1, wherein the one or more characteristics of the raw output that correspond to the one or more geometrical characteristics of some of the patterned features cannot be suppressed by Fourier filtering.

12. The method of claim 1, wherein the one or more defect detection parameters comprise a threshold to be applied to a difference between the individual output and a reference.

13. The method of claim 1, wherein said separately assigning the one or more defect detection parameters is performed such that defects are detected using the individual output assigned to the different segments with different sensitivities.

14. The method of claim 1, wherein said acquiring is performed in one pass of a multi-pass inspection of the wafer, and wherein the computer-implemented method is not performed for raw output acquired in another pass of the multi-pass inspection.

15. The method of claim 1, wherein said acquiring is performed in one pass of a multi-pass inspection of the wafer, wherein the computer-implemented method is not performed for raw output acquired in another pass of the multi-pass inspection, wherein additional defects are detected using the raw output acquired in the other pass, and wherein the method further comprises combining the defects and the additional defects to generate inspection results for the wafer.

16. The method of claim 1, further comprising applying one or more predetermined defect detection parameters to the raw output to detect additional defects on the wafer and combining the defects and the additional defects to generate inspection results for the wafer.

17. A computer-readable medium, comprising program instructions executable on a computer system for performing a method for detecting defects on a wafer, wherein the method comprises:

acquiring raw output for a wafer generated by an inspection system;

identifying one or more characteristics of the raw output that correspond to one or more geometrical characteristics of patterned features formed on the wafer;

assigning individual output in the raw output to different segments based on the identified one or more characteristics of the raw output such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments are different, wherein the one or more geometrical characteristics that correspond to one of the different segments comprise one or more geometrical characteristics of page breaks, and wherein the one or more geometrical characteristics that correspond to another of the different segments comprise one or more geometrical characteristics of array areas;

separately assigning one or more defect detection parameters to the different segments; and

applying the assigned one or more defect detection parameters to the individual output assigned to the different segments to thereby detect defects on the wafer.

18. A system configured to detect defects on a wafer, comprising:

an inspection subsystem configured to generate raw output for a wafer by scanning the wafer; and

a computer subsystem configured to;

acquire the raw output;

identify one or more characteristics of the raw output that correspond to one or more geometrical characteristics of patterned features formed on the wafer;

assign individual output in the raw output to different segments based on the identified one or more characteristics of the raw output such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments are different, wherein the one or more geometrical characteristics that correspond to one of the different segments comprise one or more geometrical characteristics of page breaks, and wherein the one or more geometrical characteristics that correspond to another of the different segments comprise one or more geometrical characteristics of array areas;

separately assign one or more defect detection parameters to the different segments; and

apply the assigned one or more defect detection parameters to the individual output assigned to the different segments to thereby detect defects on the wafer.