MEMS sensor using multi-layer movable combs

• US 8,776,601 B2
• Filed: 11/21/2011
• Issued: 07/15/2014
• Est. Priority Date: 11/23/2010
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Horning, Robert D., Supino, Ryan
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US13/301,145
• Publication Number:
  US 20120126881A1
• Time in Patent Office: 967 Days
• Field of Search: 735/141.7, 735/141.8, 735/143.2, 735/143.8, 735/041.2, 735/041.4, 735/040.4
• US Class Current: 73/514.32
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 2203/0136 Comb structures
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage

Abstract

A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs, wherein the proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one fixed anchor having a second plurality of combs. The first plurality of combs is interleaved with the second plurality of combs. Each of the combs in the first plurality of combs and the second plurality of combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that fringing electric fields are screened to reduce motion of the first plurality of combs along a sense axis due to the fringing electric fields.

Claims

1. A Micro-electro-mechanical system (MEMS) sensor, comprising:

a substrate;

at least one proof mass having a first plurality of combs, wherein the proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable;

at least one anchor having a second plurality of combs, wherein the anchor is coupled to the substrate such that the anchor and the second plurality of combs are fixed in position relative to the substrate;

wherein the first plurality of combs is interleaved with the second plurality of combs;

wherein each of the combs in the first plurality of combs and the second plurality of combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers;

wherein each conductive layer is individually coupled to a respective electric potential such that fringing electric fields are screened to reduce motion of the first plurality of combs along a sense axis due to the fringing electric fields.

2. The MEMS sensor of claim 1, wherein each comb of the first and second plurality of combs comprises a first outer conductive layer, a second outer conductive layer, and an inner conductive layer.

3. The MEMS sensor of claim 2, wherein the first and second outer conductive layers of each comb of the first and second plurality of combs is coupled to ground;

wherein the inner layer of each comb of the first plurality of combs is coupled to ground and the inner layer of each comb of the second plurality of combs is coupled to a time-varying voltage.

4. The MEMS sensor of claim 1, wherein an outermost layer of each comb of the first and second pluralities of combs is coupled to ground.

5. The MEMS sensor of claim 1, wherein an outermost layer of each comb of the first and second pluralities of combs that is closest to a first conductive plate located above the proof mass is coupled to an electric potential having the same voltage as a voltage applied to the first conductive plate;

and

wherein an outermost layer of each comb of the first and second pluralities of combs that is closest to a second conductive plate located below the proof mass is coupled to an electric potential having the same voltage as a voltage applied to the second conductive plate.

6. The MEMS sensor of claim 1, wherein the combs of the first and second plurality of combs are comprised of silicon, the plurality of conductive layers comprising regions of heavily doped silicon and the one or more non-conductive layers comprising regions of undoped silicon.

7. The MEMS sensor of claim 1, wherein the plurality of conductive layers in each comb do not have a uniform thickness.

8. An electronic system comprising:

an inertial measurement unit comprising one or more micro-electro-mechanical system (MEMS) sensors configured to provide motion measurements; and

a processing unit configured to process the motion measurements received from the inertial measurement unit;

wherein the one or more MEMS sensors each comprise;

a plurality of fixed combs; and

a plurality of movable combs interleaved with the plurality of fixed combs;

wherein each of the plurality of fixed and movable combs comprises a plurality of conductive layers separated by one or more non-conductive layers, each conductive layer configured to be individually coupled to a respective voltage such that electrical fringing fields about the movable combs are balanced by the respective voltage applied to each conductive layer.

9. The electronic system of claim 8, wherein the plurality of conductive layers of each movable and fixed comb in the one or more MEMS sensors comprises:

two conductive shield layers, each shield layer adjacent to an outer surface of the respective comb; and

at least one inner layer.

10. The electronic system of claim 9, wherein the shield layers of each fixed and movable comb in the one or more MEMS sensors are coupled to ground;

wherein the at least one inner layer of the fixed combs is coupled to a time-varying voltage and the at least one inner layer of the movable combs is coupled to ground.

11. The electronic system of claim 9, wherein the at least one inner layer of each comb in the one or more MEMS sensors is thicker than each of the respective shield layers.

12. The electronic system of claim 9, wherein the one or more MEMS sensors further comprise:

a first conductive plate coupled to a first voltage; and

a second conductive plate coupled to a second voltage;

wherein one of the shield layers closest to the first conductive plate in each comb is coupled to the first voltage and the other shield layer in each comb is coupled to the second voltage.

13. The electronic system of claim 8, wherein the fixed and movable combs of the one or more MEMS sensors are comprised of silicon;

wherein the plurality of conductive layers comprise regions of heavily doped silicon and the one or more non-conductive layers comprise regions of lightly doped silicon.

14. The electronic system of claim 8, wherein the one or more non-conductive layers of the fixed and movable combs in the one or more MEMS sensors are thinner than each of the plurality of conductive layers.

15. The electronic system of claim 8, wherein the one or more MEMS sensors are MEMS gyroscopes.

16. A method of reducing out-of-plane forces generated in an electrostatic drive comb, the method comprising:

applying a first electric potential to a first conductive plate above a proof mass having a plurality of movable combs and above an anchor having a plurality of fixed combs interleaved between the plurality of movable combs, each of the plurality of movable combs and the plurality of fixed combs having a plurality of conductive layers separated by one or more non-conductive layers;

applying a second electric potential to a second conductive plate below the proof mass and the anchor;

individually applying a respective electric potential to each of the plurality of conductive layers in each of the plurality of fixed combs and in each of the plurality of movable combs to balance electric fields produced by the first and second conductive plates.

17. The method of claim 16, wherein each of the fixed combs and the movable combs comprises a first outer conductive layer, a second outer conductive layer and an inner layer;

wherein individually applying the respective electric potential comprises;

applying a ground potential to each of the first and second outer conductive layers in each of the fixed and the movable combs;

applying a ground potential to the inner layer of each of the movable combs; and

applying a time-varying electric potential to the inner layer of each of the fixed combs.

18. The method of claim 16, wherein each of the fixed combs and the movable combs comprises a first outer conductive layer, a second outer conductive layer and an inner layer;

wherein individually applying the respective electric potential comprises;

applying the first electric potential to each of the first outer conductive layers in each of the fixed and the movable combs;

applying the second electric potential to each of the second outer conductive layers in each of the fixed and the movable combs

applying a ground potential to the inner layer of each of the movable combs; and

applying a time-varying electric potential to the inner layer of each of the fixed combs.

19. The method of claim 16, wherein each of the fixed combs and each of the movable combs are comprised of silicon, the plurality of conductive layers in each respective comb comprising regions of heavily doped silicon and the one or more non-conductive layers comprising regions of undoped silicon.

20. The method of claim 16, wherein the conductive layers of each respective comb do not have a uniform size.