Hybrid solid state emitter printed circuit board for use in a solid state directional lamp
First Claim
Patent Images
1. A lamp comprising:
- a printed circuit board;
a metal heat spreader assembled with the printed circuit board; and
a solid state light emitter positioned on the assembled printed circuit board and metal heat spreader such that the solid state light emitter directs light rays towards an interior of the lamp, wherein the metal heat spreader is configured to conduct heat generated by the solid state light emitter when energized;
wherein the printed circuit board defines an aperture and at least a portion of the metal heat spreader is positioned in the aperture of the printed circuit board.
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Abstract
An assembly for use in a solid state directional lamp is disclosed. The assembly includes a multilayer FR4 printed circuit board and a metal heat spreader assembled with the multilayer FR4 printed circuit board. The assembly is configured to mount a plurality of solid state light emitters. The multilayer FR4 printed circuit board defines an aperture and a least a portion of the metal heat spreader is positioned in the aperture of the multilayer FR4 printed circuit board. The portion of the heat spreader positioned in the aperture of the multilayer FR4 printed circuit board is in communication with heat dissipation means.
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Citations
23 Claims
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1. A lamp comprising:
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a printed circuit board; a metal heat spreader assembled with the printed circuit board; and a solid state light emitter positioned on the assembled printed circuit board and metal heat spreader such that the solid state light emitter directs light rays towards an interior of the lamp, wherein the metal heat spreader is configured to conduct heat generated by the solid state light emitter when energized; wherein the printed circuit board defines an aperture and at least a portion of the metal heat spreader is positioned in the aperture of the printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An assembly for use in a lamp, comprising:
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a main printed circuit board; a metal heat spreader assembled with the main printed circuit board; wherein the assembled main printed circuit board and metal heat spreader are configured to mount a solid state light emitter such that the solid state light emitter directs light rays towards an interior of the lamp; wherein the main printed circuit board defines an aperture and at least a portion of the metal heat spreader is positioned in the aperture of the main printed circuit board; wherein the metal heat spreader is configured to conduct heat generated by the solid state light emitter when energized; and wherein the metal heat spreader is in communication with heat dissipation means. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification