Encapsulation sheet, method of manufacturing organic light emitting display device using the same, and organic light emitting display device

• US 8,778,713 B2
• Filed: 02/27/2013
• Issued: 07/15/2014
• Est. Priority Date: 08/28/2012
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Kim, Min-Soo, Park, Jin-Woo, Hyun, Won-Sik
• Primary Examiner(s): Karimy, Timor
• Application Number:
  US13/779,410
• Publication Number:
  US 20140065344A1
• Time in Patent Office: 503 Days
• Field of Search: 438/34, 438/82, 438/99
• US Class Current: 438/34
• CPC Class Codes: B32B 3/04 characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 59/8731 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: Y10T 428/23 Sheet including cover or casing
• CPC Class Codes: Y10T 428/24851 Intermediate layer is discontinuous or differential

Abstract

In one aspect, an encapsulation sheet, a method of manufacturing an organic light emitting display device using the encapsulation sheet, and an organic light emitting display device is provided. The encapsulation sheet includes a carrier film; and a first sheet formed on the carrier film, wherein the first sheet comprises at least one of tin fluorophosphates glass, chalcogenide glass, tellurite glass, borate glass, and phosphate glass.

Claims

1. A method of manufacturing an organic light emitting display device, the method comprising:

forming an organic electroluminescence unit on a substrate;

locating an encapsulation sheet that comprises a carrier film and a first sheet on the carrier film on the organic electroluminescence unit;

forming an encapsulation layer formed of the first sheet by heating the encapsulation sheet; and

separating the carrier film from the encapsulation layer,

wherein the first sheet is formed of a low liquidus temperature material, and the low liquidus temperature material comprises at least one of tin fluorophosphates glass, chalcogenide glass, tellurite glass, borate glass, and phosphate glass.

2. The method of claim 1, wherein the encapsulation sheet further comprises a second sheet formed between the carrier film and the first sheet.

3. The method of claim 2, further comprising forming a plurality of additional first sheets and a plurality of additional second sheets, where each first sheet is alternately formed on each second sheet.

4. The method of claim 3, wherein the first sheet comprises tin fluorophosphates glass and the tin fluorophosphates glass comprises tin (Sn) by 20 to 80 weight %, phosphorus (P) by 2 to 20 weight %, oxygen (O) by 3 to 20 weight %, and fluorine (F) by 10 to 36 weight %.

5. The encapsulation sheet of claim 3, wherein the additional first sheet comprises tin fluorophosphates glass and the tin fluorophosphates glass comprises tin (Sn) by 20 to 80 weight %, phosphorus (P) by 2 to 20 weight %, oxygen (O) by 3 to 20 weight %, and fluorine (F) by 10 to 36 weight %.

6. The method of claim 2, wherein the second sheet comprises tungsten.

7. The method of claim 2, wherein when the encapsulation sheet is heated to a temperature where the low liquidus temperature material and the tungsten react with each other.

8. The method of claim 1, wherein the encapsulation sheet further comprises an intermediate layer between the carrier film and the first sheet.

9. The method of claim 1, wherein the first sheet comprises tin fluorophosphates glass and the tin fluorophosphates glass comprises tin (Sn) by 20 to 80 weight %, phosphorus (P) by 2 to 20 weight %, oxygen (O) by 3 to 20 weight %, and fluorine (F) by 10 to 36 weight %.

10. The method of claim 1, wherein a temperature of the heat applied to the encapsulation sheet is 200°

C. or less.

11. The method of claim 10, wherein the temperature of the heat applied to the encapsulation sheet is from about 150°

C. to 200°

C.