Modified polyimide and method for producing modified polyimide

• US 8,779,085 B2
• Filed: 04/30/2010
• Issued: 07/15/2014
• Est. Priority Date: 04/30/2009
• Status: Expired due to Fees

• Current Assignee: PI R&D Co.,Ltd.
• Original Assignee: PI R&D Co.,Ltd.
• Inventors: Goshima, Toshiyuki, Win, Maw Soe, Kyo, Eika
• Primary Examiner(s): Leonard, Michael L
• Application Number:
  US13/266,925
• Publication Number:
  US 20120097439A1
• Time in Patent Office: 1,537 Days
• Field of Search: 528/59, 528/61, 528/64, 528/310, 528/328, 528/329.1, 525/520, 525/453, 525/454
• US Class Current: 528/329.1
• CPC Class Codes: C08G 18/10 Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
• CPC Class Codes: C08G 18/346 having four carboxylic acid groups
• CPC Class Codes: C08G 18/44 Polycarbonates
• CPC Class Codes: C08G 69/36 derived from amino acids, polyamines and polycarboxylic acids
• CPC Class Codes: C08G 73/1035 from tetracarboxylic acids or derivatives and diisocyanates
• CPC Class Codes: C08G 73/1042 Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
• CPC Class Codes: C08G 73/1078 wholly aromatic in the diamino moiety
• CPC Class Codes: C08J 2379/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08J 5/18 Manufacture of films or sheets
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C09D 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 3/285 Permanent coating compositions

Abstract

The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof. According to the method in which an isocyanate-terminated oligomer comprising a polycarbonate component having excellent flexibility is allowed to react with a tetracarboxylic dianhydride to synthesize a tetracarboxylic dianhydride oligomer comprising the polycarbonate component and the thus obtained oligomer is then further allowed to react with an aromatic diamine and aromatic tetracarboxylic dianhydride to produce a polyimide block copolymer, by selecting the aromatic diamine from a wide range of selectable aromatic diamines, an excellent modified polyimide satisfying all of the above-described various characteristics can be produced.

Claims

1. A method of producing a modified polyimide, comprising a first step in which an isocyanate-terminated oligomer represented by Formula (I):

2. The method according to claim 1, wherein said second step is carried out in a non-nitrogen-containing solvent.

3. The method according to claim 1 or 2, wherein said modified polyimide has a number average molecular weight of 6,000 to 60,000.

4. The method according to claim 1, wherein said A in said Formulae (IV) and (V) has a structure represented by:

5. A modified polyimide, which has a structure represented by Formula (V):

6. The modified polyimide according to claim 5, which has a number average molecular weight of 6,000 to 60,000.

7. A modified polyimide resin composition, which has the modified polyimide according to claim 5 or 6 in an organic solvent.

8. The composition according to claim 7, wherein said organic solvent is a non-nitrogen-containing solvent.

9. The composition according to claim 7, which comprises said modified polyimide resin in an amount of 10 to 50% by weight.

10. The composition according to claim 7, which comprises 1 to 20 parts by weight of a non-halogen flame retardant with respect to 100 parts by weight of said modified polyimide resin.

11. The composition according to claim 7, which comprises, with respect to (A) 100 parts by weight of polyimide, (B) 1 to 1,000 parts by weight of a mixed solvent of two or more solvents, (C) 5 to 20 parts by weight of said non-halogen flame retardant, (D) 5 to 20 parts by weight of organic and/or inorganic particles and (E) 0.1 to 3.0 parts by weight of a coloring agent, antifoaming agent, leveling agent and/or adhesion-imparting agent.

12. The composition according to claim 7, which has a viscosity of 15,000 to 70,000 mPa·

s (25°

C.).

13. A resin film obtained by forming a film of the modified polyimide resin composition according to claim 7 and heating the thus formed film to remove said solvent.

14. A resin film composed of a cured product of the resin film according to claim 13.

15. A printed circuit board, which is partially or entirely covered with the resin film according to claim 13.

16. An electronic component comprising the resin film according to claim 13.