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Cooling system

  • US 8,783,333 B1
  • Filed: 12/15/2009
  • Issued: 07/22/2014
  • Est. Priority Date: 12/15/2009
  • Status: Active Grant
First Claim
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1. A cooling system comprising:

  • an evaporator assembly configured to thermally contact a plurality of memory modules and absorb thermal energy from the plurality of memory modules; and

    a condenser assembly thermally coupled to the evaporator assembly via a plurality of tubing assemblies, wherein at least a portion of each of the plurality of tubing assemblies is located between adjacent memory modules, wherein the condenser assembly is configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporator assembly, and wherein each of the plurality of tubing assemblies include a plurality of thermally-conductive deflectable members spaced apart from one another, wherein the plurality of thermally-conductive deflectable members partially encase each of the plurality of tubing assemblies and conform to a shape of each of the plurality of tubing assemblies, wherein the plurality of thermally-conductive deflectable members separate the plurality of memory modules from directly contacting the plurality of tubing assemblies.

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