Detergent product and method for making same
First Claim
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1. A detergent product comprising a plurality of inter-entangled filaments, wherein at least one of the filaments contains one or more active agents present in the filament at a total level of greater than 20% by weight on a dry filament basis and one or more water-soluble filament-forming materials comprising a hydroxyl polymer, wherein the detergent product exhibits a Basis Weight of less than 500 g/m2 as measured according to the Basis Weight Test Method described herein.
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Abstract
A detergent product containing a detergent composition is provided.
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33 Claims
- 1. A detergent product comprising a plurality of inter-entangled filaments, wherein at least one of the filaments contains one or more active agents present in the filament at a total level of greater than 20% by weight on a dry filament basis and one or more water-soluble filament-forming materials comprising a hydroxyl polymer, wherein the detergent product exhibits a Basis Weight of less than 500 g/m2 as measured according to the Basis Weight Test Method described herein.
- 11. A detergent product comprising a plurality of inter-entangled filaments, wherein at least one of the filaments contains one or more active agents present in the filament at a total level of greater than 20% by weight on a dry filament basis and one or more water-soluble filament-forming materials comprising a hydroxyl polymer, wherein the detergent product exhibits a MD Peak Elongation of greater than 10% as measured according to the Elongation Test Method described herein.
- 21. A detergent product comprising a plurality of inter-entangled filaments, wherein at least one of the filaments contains one or more active agents present in at least one of the filaments at a total level of greater than 20% by weight on a dry filament basis and one or more water-soluble filament-forming materials comprising a hydroxyl polymer, wherein the detergent product exhibits a GM Modulus of less than 15,000 g/cm2 as measured according to the Modulus Test Method described herein.
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