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Semiconductor package integrated with conformal shield and antenna

  • US 8,786,060 B2
  • Filed: 05/04/2012
  • Issued: 07/22/2014
  • Est. Priority Date: 05/04/2012
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a substrate;

    a semiconductor die disposed on the substrate;

    a package body encapsulating the semiconductor die and having an upper surface;

    an electromagnetic interference shield formed directly on the upper surface of the package body;

    a dielectric structure covering the electromagnetic interference shield;

    an antenna formed on the dielectric structure;

    a feeding element connecting the antenna and a feeding point of the substrate; and

    an antenna grounding element connecting the antenna and the electromagnetic interference shield, wherein the feeding element penetrates the package body and the dielectric structure.

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