Radio frequency (RF) antenna containing element and methods of making the same

• US 8,786,510 B2
• Filed: 01/24/2006
• Issued: 07/22/2014
• Est. Priority Date: 01/24/2006
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: Akhave, Jay, Dimalanta, Eric, Coleman, James P.
• Primary Examiner(s): Wimer, Michael C
• Application Number:
  US11/338,590
• Publication Number:
  US 20070171129A1
• Time in Patent Office: 3,101 Days
• Field of Search: 343/895, 343/700.MS, 343/795, 340/572.7, 235/492
• US Class Current: 343/795
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 156/1082 Partial cutting bonded sandwich [e.g., grooving or incising]
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 156/1994 Means for delaminating from release surface
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.

Claims

1. A radio frequency (RF) antenna containing element comprising:

a metal foil laminate antenna that includes a shaped metal foil layer bonded to a reinforcement layer by a first adhesive layer wherein the shaped metal foil layer has a shape matching a shape of an antenna structure;

an opening creating a gap in the metal foil laminate antenna to define antenna contact ends, the gap being sized to allow placement of an RFID chip;

a carrier layer bonded to the metal foil laminate antenna by a second adhesive layer wherein the second adhesive layer has a shape matching the shape of the antenna structure; and

contact extensions extending from the antenna contact ends into the gap for allowing direct chip placement and

wherein the antenna is formed by die cutting in the shape of the antenna structure through the metal foil laminate antenna and the second adhesive layer to the underlying carrier layer.

2. The element of claim 1, wherein the metal foil layer is formed from one of aluminum foil, copper foil and steel foil, the metal foil layer has a thickness in the range of about 1.5 microns to about 20 microns.

3. The element of claim 1, wherein the reinforcement layer has a thickness in the range about 0.1 mils to about 1 mil.

4. The element of claim 1, wherein the reinforcement layer is formed from one of a polymeric film comprising one of a polyester film, polyethylene terephthalate (PET) film, and polyimide film and paper.

5. The element of claim 1, wherein the carrier layer is one of a polymeric film and paper, the carrier layer having a thickness in the range of about 1 mil to about 3 mil.

6. The element of claim 1, wherein the adhesive layer that bonds the metal foil layer to the reinforcement layer has a thickness in the range of about 1 micron to about 3 microns.

7. The element of claim 1, further comprising a chip conductively coupled to the contact ends of the metal foil laminate antenna.

8. The element of claim 1, further comprising an adhesive layer that bonds the metal foil laminate antenna to the carrier layer, the adhesive layer that bonds the metal foil laminate antenna to the carrier layer having a thickness in the range of about 5 microns to about 25 microns.

9. The element of claim 8, wherein the adhesive layer is formed from one of a pressure activated adhesive and an Ultra-Violet (UV) curable adhesive.

10. The element of claim 1, wherein the contact extensions are formed of a copper foil that includes generally right angle bends at the contact ends at a top surface of the metal foil laminate antenna and generally right angle bends at a top surface of the carrier layer such that ends of the contact extension at the top surface of the carrier layer provide bonding pads for direct chip placement.

11. The element of claim 1, wherein the contact extensions are formed of at least one of copper foil, electro-deposited copper, conductive ink and conductive adhesive.

12. The element of claim 1, wherein the metal foil laminate antenna is releasably attached to the carrier layer.

13. The Radio Frequency (RF) antenna containing element of claim 1 wherein the opening is T-shaped.

14. A radio frequency antenna assembly, comprising:

a carrier layer having first and second faces;

a first adhesive layer provided on one of the first and second faces, wherein the first adhesive layer each has a shape matching a shape of an antenna structure;

a reinforcement layer disposed on the first adhesive layer;

a metal foil layer placed on the reinforcement layer and permanently bonded thereto by a second adhesive layer to form a reinforced metal foil laminate;

wherein the reinforced metal foil laminate has an opening that defines antenna contact ends and a gap sized to allow placement of a RFID chip,

contact extensions extending from the antenna contact ends into the gap for allowing direct chip placement; and

wherein the antenna is formed by die cutting the shape of the antenna structure through the reinforced metal foil laminate and the first adhesive layer to the underlying carrier layer and the carrier layer is at least in registry with the first patterned adhesive layer.

15. A radio frequency antenna assembly as recited in claim 14, wherein the foil laminate has a gap for placement of an integrated circuit.

17. A radio frequency antenna assembly as recited in claim 15, wherein the antenna contact ends are spaced a distance apart to accommodate and integrated circuit.

18. The Radio Frequency (RF) antenna assembly of claim 14 wherein the opening is T-shaped.

16. A radio frequency antenna assembly, comprising:

a carrier layer;

a polymeric film adhesively applied to the carrier layer by a first adhesive layer, the polymeric film forming a reinforcement layer;

a die cut foil layer permanently adhered by a second adhesive layer to the polymeric film, the die cut foil layer and the first adhesive layer having a shape of a radio frequency antenna, and the die cut foil layer having an elongation of between 20% and 30%, and the die cut foil layer having an opening to define antenna contact ends and a gap that is sized to allow placement of a RFID chip;

contact extensions extending from the antenna contact ends into the gap for allowing direct chip placement; and

wherein the shape of the die cut foil layer and the first adhesive layer match the shape of the radio frequency antenna and the shape is formed by die cutting in the shape of the antenna structure through the metal laminate and the first and the second adhesive layer, but not through the underlying carrier layer.

19. The Radio Frequency (RF) antenna assembly of claim 16 wherein the opening is T-shaped.